公开(公告)号：US20250038143A1

公开(公告)日：2025-01-30

申请号：US18753556

申请日：2024-06-25

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chun-Chia Yeh

IPC: H01L23/00 ,  H01L23/31

Abstract: A chip provided to be flip bonded to a circuit board includes at least one bump and at least one supportive element which protrudes from an active surface of the chip and is located between the bump and a first side of the active surface. The supportive element is provided to support a lead on the circuit board to prevent the lead from contacting a metal burr protruding from the active surface or a metal cut surface exposed on a side wall of the chip. The supportive element can protect the chip and the lead from short circuit or electrical abnormality.

公开(公告)号：US20240347493A1

公开(公告)日：2024-10-17

申请号：US18383512

申请日：2023-10-25

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Wei-Hsin Wu ,  Ku-Pang Chang ,  Chun-Chia Yeh

IPC: H01L23/00 ,  H01L23/498 ,  H05K1/11

CPC classification number: H01L24/16 ,  H01L23/49838 ,  H01L24/08 ,  H05K1/118 ,  H01L2224/0801 ,  H01L2224/08225 ,  H01L2224/16012 ,  H01L2224/16225 ,  H01L2924/3511 ,  H01L2924/384

Abstract: A semiconductor package includes a flexible circuit board and a chip which includes a first bump group and a second bump group. First bumps of the first bump group and second bumps of the second bump group are provided to be bonded to leads on the flexible circuit board. The second bumps are designed to be longer than the first bumps in length so as to increase bonding strength of the second bumps to the leads, prevent the leads from being shifted and separated from the first and second bumps and prevent lead bonding misalignment.