公开(公告)号：US10242899B2

公开(公告)日：2019-03-26

申请号：US15456652

申请日：2017-03-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chien-Ming Kuo ,  Hung-Ching Chang

IPC: H01L21/00 ,  H01L21/677 ,  H01L21/673

Abstract: A wafer cassette for storing wafers comprises a case and a plurality of carriers for carrying the wafers. Each of the carriers is pivotally and movably mounted to a pivot of the case, and can selectively accommodate in or depart from an accommodation space of the case for benefit of the wafer loading or unloading.

公开(公告)号：US20180211860A1

公开(公告)日：2018-07-26

申请号：US15456652

申请日：2017-03-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Chien-Ming Kuo ,  Hung-Ching Chang

IPC: H01L21/677 ,  H01L21/673

CPC classification number: H01L21/67766 ,  H01L21/00 ,  H01L21/6732 ,  H01L21/67379 ,  H01L21/67383 ,  H01L21/67386 ,  H01L21/67769 ,  H01L21/67778

Abstract: A wafer cassette for storing wafers comprises a case and a plurality of carriers for carrying the wafers. Each of the carriers is pivotally and movably mounted to a pivot of the case, and can selectively accommodate in or depart from an accommodation space of the case for benefit of the wafer loading or unloading.