公开(公告)号：US20230326896A1

公开(公告)日：2023-10-12

申请号：US18108733

申请日：2023-02-13

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Sheng-Jen Wu ,  Shih-Chung Chang ,  Hsueh-Shun Yeh ,  Chun-Te Lee

IPC: H01L23/00

CPC classification number: H01L24/26 ,  H01L24/32 ,  H01L24/29 ,  H01L24/05 ,  H01L2224/26125 ,  H01L2224/04026 ,  H01L2224/05558 ,  H01L2224/05573 ,  H01L2224/05666 ,  H01L2224/05684 ,  H01L2924/0132 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05644 ,  H01L2224/05672 ,  H01L2224/29144 ,  H01L2224/29147 ,  H01L2224/29111 ,  H01L2224/29139 ,  H01L2224/29109 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29017 ,  H01L2224/29019 ,  H01L2224/29034 ,  H01L2224/32225

Abstract: A COF package includes a substrate and a chip, composite bumps on the chip are bonded to leads on the substrate. Each of the composite bumps includes a raising strip, a UBM layer and a bonding layer. A bonding rib is formed on the bonding layer because of the raising strip and the UBM layer, and the bonding rib on each of the composite bumps can be inserted into each of the leads and surface-contact with each of the leads to increase weld length and bonding strength between the bonding layer and the leads and further reduce a force required for bonding the chip to the substrate in a flip-chip bonding process.