公开(公告)号：US20250142719A1

公开(公告)日：2025-05-01

申请号：US18909469

申请日：2024-10-08

Applicant: Chipbond Technology Corporation

Inventor： Chiu-Hong Lai ,  Wen Ping Hsu ,  Yi Ling Hsieh ,  Dong-Sheng Li ,  Yi Ren Chian ,  San Lee ,  Pei-Ying Lee ,  Ting-Yi Kuo

IPC: H05K1/02 ,  H05K1/09 ,  H05K1/18

Abstract: A flexible circuit board designed for chip integration is provided. The flexible circuit board includes an insulating substrate, a conductive copper layer, a first tin layer, a second tin layer, and a first solder resist layer. The first tin layer has a first tin thickness, and the second tin layer has a greater second tin thickness. A first tin surface of the first tin layer and a second tin surface of the second tin layer are substantially level.

公开(公告)号：US20240371741A1

公开(公告)日：2024-11-07

申请号：US18614963

申请日：2024-03-25

Applicant: CHIPBOND TECHNOLOGY CORPORATION

Inventor： Hou-Chang Kuo ,  Wen-Ping Hsu ,  Ting-Yi Kuo ,  Yi-Ling Hsieh

IPC: H01L23/498

Abstract: A layout structure of a flexible circuit board includes a flexible substrate, a circuit layer and a dummy circuit layer which are arranged on the flexible substrate. The circuit layer includes first inner leads, second inner leads, an inverted U-shape connection line and a horizontal inner lead. A first distance between the first inner leads is less than a second distance between the second inner leads. One of dummy leads of the dummy circuit layer is located between the first and second inner leads, another dummy lead is located between the second inner leads. The dummy leads are provided to allow lead spaces on both sides of the inverted U-shape connection line is the same. Thus, etching solution will not flow laterally in an etching space between the inverted U-shape connection line and the horizontal inner lead.