公开(公告)号：US20230207897A1

公开(公告)日：2023-06-29

申请号：US17945146

申请日：2022-09-15

Applicant: CONTEMPORARY AMPEREX TECHNOLOGY CO., LIMITED

Inventor： Xin LI ,  Zhaohang SHI

IPC: H01M10/42 ,  H05K1/11 ,  H05K1/09 ,  H05K1/18

CPC classification number: H01M10/425 ,  H05K1/111 ,  H05K1/09 ,  H05K1/181 ,  H01M2220/20 ,  H05K2201/035

Abstract: This application discloses a printed circuit board, a battery module, a battery pack, and an electrical device. The printed circuit board may include: a substrate, a pad, a solder paste layer, a component body, and a support assembly. The pad may be disposed above the substrate. The solder paste layer may be disposed above the pad. The component body may be disposed above the solder paste layer. The support assembly may be disposed between the pad and the component body to form a degassing space between the component body and the solder paste layer.