公开(公告)号：US20190159331A1

公开(公告)日：2019-05-23

申请号：US16098537

申请日：2017-05-04

Applicant: CORNELL UNIVERSITY

Inventor： Amit Lal ,  Thomas Schenkel ,  Arun Persaud ,  Qing JI ,  Peter Seidl ,  Will Waldron ,  Serhan Ardanuc ,  Vinaya Kumar Kadayra Basavarajappa

IPC: H05H7/22 ,  H05H9/04 ,  H05H7/02

CPC classification number: H05H7/22 ,  H05H7/02 ,  H05H7/08 ,  H05H9/04 ,  H05H13/00 ,  H05H2007/025 ,  H05H2007/045

Abstract: A wafer-based charged particle accelerator includes a charged particle source and at least one RF charged particle accelerator wafer sub-assembly and a power supply coupled to the at least one RF charged particle accelerator wafer sub-assembly. The wafer-based charged particle accelerator may further include a beam current-sensor. The wafer-based charged particle accelerator may further include at least a second RF charged particle accelerator wafer sub-assembly and at least one ESQ charged particle focusing wafer. Fabrication methods are disclosed for RF charged particle accelerator wafer sub-assemblies, ESQ charged particle focusing wafers, and the wafer-based charged particle accelerator.