公开(公告)号：US20240292523A1

公开(公告)日：2024-08-29

申请号：US18571937

申请日：2022-06-15

Applicant: CORNING INCORPORATED

Inventor： JOON-SOO KIM ,  YOUNG SUK LEE ,  BYUNGDOO MOON ,  HYUNG SOO MOON

IPC: H05K1/02 ,  C03C17/09 ,  C03C17/10 ,  C03C17/36 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H05K1/09 ,  H05K3/18

CPC classification number: H05K1/0271 ,  C03C17/09 ,  C03C17/10 ,  C03C17/3639 ,  C03C17/3649 ,  C23C14/185 ,  C23C18/38 ,  C23C28/023 ,  H05K1/09 ,  C03C2218/111 ,  C03C2218/154 ,  H05K3/181 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2203/072

Abstract: A layered structure, an article such as circuit board including such a layered structure, and methods of making the same are provided. The layered structure includes a substrate comprising glass or glass ceramic, an adhesion layer disposed on the substrate, a seed layer disposed on the adhesion layer, a first conductive layer disposed on the seed layer, and a second conductive layer disposed on the first conductive layer. The seed layer includes a first metal material and has a first type of stress with respect to the substrate. The first conductive layer includes the first metal material and has a second type of stress with respect to the substrate. The second conductive layer includes a second metal material and has the first type of stress with respect to the substrate. The layered structure may further include additional pairs of alternating layers of the first and the second conductive layers.