公开(公告)号：US20230161197A1

公开(公告)日：2023-05-25

申请号：US17920941

申请日：2021-04-13

Applicant: CORNING INCORPORATED ,  CORNING PRECISION MATERIALS CO. LTD

Inventor： GUANGLEI DU ,  JOON-SOO KIM

IPC: G02F1/13357

CPC classification number: G02F1/133606 ,  G02F1/133605

Abstract: A backlight that includes a plurality of light sources coupled to a substrate, and a patterned diffuser over the plurality of light sources is disclosed. The patterned diffuser including a plurality of patterned reflectors coupled to a patterned diffuser body, where each patterned reflector is positioned to align with a corresponding light source. The backlight has a longitudinal direction, and the substrate and the patterned diffuser body have a maximum longitudinal substrate dimension (LMax,S) and a maximum longitudinal patterned diffuser body dimension (LMax,PDB), respectively, in the longitudinal direction. The backlight has a thermal alignment tolerance in the longitudinal direction at 60° C. is 500 microns or less, where the thermal alignment tolerance at the 60° C. is the absolute value of [the smaller of LMax,S and LMax,PDB] x [60° C. - 23.5° C. (room temperature)] x [substrate coefficient of thermal expansion (CTES) - light guide plate coefficient of thermal expansion (CTEPDB)].

公开(公告)号：US20240292523A1

公开(公告)日：2024-08-29

申请号：US18571937

申请日：2022-06-15

Applicant: CORNING INCORPORATED

Inventor： JOON-SOO KIM ,  YOUNG SUK LEE ,  BYUNGDOO MOON ,  HYUNG SOO MOON

IPC: H05K1/02 ,  C03C17/09 ,  C03C17/10 ,  C03C17/36 ,  C23C14/18 ,  C23C18/38 ,  C23C28/02 ,  H05K1/09 ,  H05K3/18

CPC classification number: H05K1/0271 ,  C03C17/09 ,  C03C17/10 ,  C03C17/3639 ,  C03C17/3649 ,  C23C14/185 ,  C23C18/38 ,  C23C28/023 ,  H05K1/09 ,  C03C2218/111 ,  C03C2218/154 ,  H05K3/181 ,  H05K2201/0338 ,  H05K2201/0341 ,  H05K2203/072

Abstract: A layered structure, an article such as circuit board including such a layered structure, and methods of making the same are provided. The layered structure includes a substrate comprising glass or glass ceramic, an adhesion layer disposed on the substrate, a seed layer disposed on the adhesion layer, a first conductive layer disposed on the seed layer, and a second conductive layer disposed on the first conductive layer. The seed layer includes a first metal material and has a first type of stress with respect to the substrate. The first conductive layer includes the first metal material and has a second type of stress with respect to the substrate. The second conductive layer includes a second metal material and has the first type of stress with respect to the substrate. The layered structure may further include additional pairs of alternating layers of the first and the second conductive layers.