公开(公告)号：US20230380062A1

公开(公告)日：2023-11-23

申请号：US17923624

申请日：2021-04-29

Applicant: CORNING INCORPORATED

Inventor： DHANANJAY JOSHI ,  CHUKWUDI AZUBUIKE OKORO ,  SCOTT CHRISTOPHER POLLARD

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/06 ,  H05K3/42

CPC classification number: H05K1/116 ,  H05K1/0306 ,  H05K3/064 ,  H05K3/42 ,  H05K2201/09509 ,  H05K2201/068 ,  H05K2201/09154 ,  H05K2201/0215 ,  H05K2201/09827 ,  H05K2201/09845

Abstract: A substrate including a via with a beveled overburden is disclosed. The substrate can include a substrate having a first surface, a second surface opposite the first surface, and a via passing from the first surface to the second surface. The via can be coated with a metallic layer that includes a first beveled overburden on the first surface, and the first beveled overburden can include a first outer edge that forms a first bevel angle greater than 95° with the first surface. The substrate can include a second beveled overburden that includes a second outer edge that forms a second bevel angle greater than 95° with the second surface. Methods of making the beveled overburdens are also disclosed.