Abstract:
A lateral double diffused metal oxide semiconductor field-effect transistor, comprising: semiconductor substrates (400, 500), body regions (401, 501) positioned in the semiconductor substrates, drift regions (404, 504) positioned in the semiconductor substrates (400, 500), source regions (405, 505) and a body leading-out region (402) which are positioned in the body regions (401, 501) and spaced from the drift regions (404, 504), a field region (508) and drain regions (406, 506) which are positioned in the drift regions (404, 504), and gates (407, 507) positioned on the surfaces of the semiconductor substrates (400, 500) to partially cover the body regions (401, 501), the drift regions (404, 504) and the field region (508), wherein the field region (508) is of a finger-like structure and comprises a plurality of strip field regions which extend from the source regions (405, 505) to the drain regions (406, 506) and are isolated by the active regions; and the strip field regions provided with strip gate extending regions extending from the gates (407, 507). The lateral double diffused metal oxide semiconductor field-effect transistor, with the strip gates on the strip field regions to deplete the whole drift regions (404, 504), can realize relatively high off-state breakdown voltage; and the impurity concentration of the whole drift regions (404, 504) is improved in the presence of a plurality of active regions, so that the turn-on resistance is reduced.