公开(公告)号：US11833718B2

公开(公告)日：2023-12-05

申请号：US17135135

申请日：2020-12-28

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli

IPC: B29C33/56 ,  B32B5/02 ,  B32B5/26 ,  B32B15/02 ,  B32B15/092 ,  B32B15/20 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/30 ,  B32B27/34 ,  B32B27/38 ,  B32B27/18 ,  B32B15/08 ,  B32B5/22 ,  B32B5/24 ,  B29C70/08

CPC classification number: B29C33/56 ,  B32B5/024 ,  B32B5/22 ,  B32B5/24 ,  B32B5/26 ,  B32B15/02 ,  B32B15/08 ,  B32B15/092 ,  B32B15/20 ,  B32B27/18 ,  B32B27/20 ,  B32B27/26 ,  B32B27/283 ,  B32B27/304 ,  B32B27/34 ,  B32B27/38 ,  B29C70/088 ,  B32B2250/03 ,  B32B2250/04 ,  B32B2250/05 ,  B32B2255/02 ,  B32B2255/26 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/101 ,  B32B2264/02 ,  B32B2264/102 ,  B32B2264/105 ,  B32B2264/108 ,  B32B2307/202 ,  B32B2307/4026 ,  B32B2307/71 ,  B32B2307/748

Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.

公开(公告)号：US11108220B2

公开(公告)日：2021-08-31

申请号：US16067407

申请日：2016-12-29

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey Sang ,  Fiorenzo Lenzi ,  Jonathan Edward Meegan ,  Leonard Macadams ,  Yiqiang Zhao ,  Dalip Kumar Kohli

IPC: B32B27/18 ,  H02G13/00 ,  B32B15/14 ,  B64D45/02 ,  B32B3/14 ,  B32B27/08 ,  B32B5/02 ,  B32B5/26 ,  B32B15/08 ,  B32B3/26 ,  B32B27/28 ,  B32B27/26 ,  B32B27/38 ,  B32B15/092 ,  B32B15/20 ,  C08G59/18

Abstract: A multifunctional surfacing material capable of providing lightning strike protection (LSP) and burn-through resistance. In one embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers, at least one of which contains one or more fire retardant compounds. In another embodiment, the multifunctional surfacing material is composed of a conductive layer positioned between two resin layers one of which is a thermally-stable layer. The surfacing material is co-curable with a composite substrate, e.g. prepreg or prepreg layup, which contains fiber-reinforced matrix resin.

公开(公告)号：US11027856B2

公开(公告)日：2021-06-08

申请号：US15778035

申请日：2016-11-29

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli ,  Kevin R. Mullery

IPC: H05B3/00 ,  H05B3/16 ,  B32B5/02 ,  B32B5/12 ,  B32B5/18 ,  B32B5/26 ,  B32B27/04 ,  B32B27/10 ,  B32B27/12 ,  B64D45/02 ,  B32B9/00 ,  B32B9/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/36 ,  B32B15/09 ,  B32B7/12 ,  B32B27/20 ,  B32B27/28 ,  B32B21/08 ,  B32B15/088 ,  B32B27/18 ,  B32B29/02 ,  B32B5/24 ,  B32B3/26 ,  B32B27/34 ,  B32B27/06 ,  B32B15/14 ,  B32B3/12 ,  B32B21/10 ,  B32B27/26 ,  B64C1/12 ,  B64C3/20

Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

公开(公告)号：US10256618B2

公开(公告)日：2019-04-09

申请号：US15446243

申请日：2017-03-01

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli

IPC: H02G13/00 ,  H05K9/00 ,  C08J5/24 ,  B32B5/02 ,  B32B5/12 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  C08G59/38 ,  C08L63/00 ,  B32B37/14 ,  C09D163/00

Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.

公开(公告)号：US12109789B2

公开(公告)日：2024-10-08

申请号：US16482907

申请日：2018-12-20

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey Sang ,  Dalip K. Kohli

IPC: B32B27/38 ,  B29C37/00 ,  B29C70/00 ,  B29C70/30 ,  B32B9/00 ,  B32B15/092 ,  B32B27/20 ,  B29K63/00 ,  B29K101/12 ,  B29K509/02

CPC classification number: B32B27/38 ,  B29C37/0032 ,  B29C37/0075 ,  B29C70/003 ,  B29C70/30 ,  B32B9/007 ,  B32B15/092 ,  B32B27/20 ,  B29K2063/00 ,  B29K2101/12 ,  B29K2509/02 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2264/108 ,  B32B2307/71 ,  B32B2307/748

Abstract: A surfacing material that is capable of ultraviolet (UV) protection and self-releasing from a mold surface. The surfacing material is a multilayer structure composed of a curable resin layer laminated to a self-releasing layer. The surfacing material is designed to be co-cured with a composite substrate, for example, a prepreg layup. After co-curing, the composite part surfaced with the surfacing material is releasable from the mold surface with ease. The self-releasing layer functions as a UV blocking layer until the cured composite substrate is ready for painting. When the self-releasing layer removed, a paint-ready surface is revealed. Such surface does not require any surface preparation prior to painting.

公开(公告)号：US11919274B2

公开(公告)日：2024-03-05

申请号：US16832313

申请日：2020-03-27

Applicant: Cytec Industries Inc.

Inventor： Bérénice Remy ,  Junjie Jeffrey Sang ,  Samuel J. Hill ,  Carmelo Luca Restuccia

IPC: B32B15/14 ,  B32B3/10 ,  B32B5/02 ,  B32B5/26 ,  B32B7/14 ,  B32B15/02 ,  B32B27/12 ,  B32B27/38

CPC classification number: B32B15/14 ,  B32B3/10 ,  B32B5/022 ,  B32B5/26 ,  B32B7/14 ,  B32B15/02 ,  B32B27/12 ,  B32B27/38 ,  B32B2250/03 ,  B32B2250/05 ,  B32B2250/40 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/726 ,  B32B2311/12

Abstract: A permeable LSP material that can be incorporated into a resin infusion process such as RTM and VaRTM. This permeable LSP material may be in the form of an elongated or continuous tape that can be used in an automated placement process such as ATL and AFP. In one embodiment, the permeable LSP material includes at least the following components: (a) a nonwoven veil of randomly arranged fibers; (b) a porous electrically conductive layer having openings through its thickness; and (c) a resin material distributed, in a non-continuous manner, throughout the nonwoven veil 11 and between the nonwoven veil and the porous conductive layer. The permeable LSP material can be brought into contact with a dry preform, followed by resin infusion and curing to form a hardened composite part having the LSP material integrated therein.

公开(公告)号：US11590742B2

公开(公告)日：2023-02-28

申请号：US16485303

申请日：2018-12-20

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey Sang ,  Dalip K. Kohli

IPC: B32B27/12 ,  B32B5/02 ,  B32B7/06 ,  B32B15/02 ,  B32B15/092 ,  B32B27/38 ,  B32B27/18 ,  B32B38/18 ,  B32B5/26

Abstract: A surfacing material that is capable of ultraviolet (UV) protection. The surfacing material is a multilayer structure composed of a woven peel ply fabric interposed between a first curable resin layer and a second curable resin layer. The surfacing material is designed to be co-cured with a composite substrate, for example, a prepreg layup. Upon curing, the peel ply fabric combined with the outer thermoset layer function as a UV protective layer. When the peel ply fabric and the outer thermoset layer are removed, a paint-ready surface is revealed. Such surface does not require any surface preparation prior to painting.

公开(公告)号：US11565825B2

公开(公告)日：2023-01-31

申请号：US17306581

申请日：2021-05-03

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli ,  Kevin R. Mullery

IPC: B32B5/24 ,  B32B5/28 ,  B32B27/06 ,  B32B27/08 ,  B32B27/12 ,  B32B27/20 ,  B32B27/26 ,  B32B27/38 ,  B32B37/24 ,  B32B38/08 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/14 ,  H05K3/07 ,  H05K3/14 ,  G21F1/00 ,  B64D45/02 ,  B32B5/02 ,  B32B9/00 ,  B32B9/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/10 ,  B32B27/36 ,  B32B15/09 ,  B32B7/12 ,  B32B27/28 ,  B32B21/08 ,  B32B5/26 ,  B32B15/088 ,  B32B27/18 ,  B32B29/02 ,  B32B3/26 ,  B32B5/18 ,  B32B27/34 ,  B32B15/14 ,  B32B3/12 ,  B32B21/10 ,  B64C1/12 ,  B64C3/20

Abstract: Multifunctional surfacing materials for use in composite structures are disclosed. According to one embodiment, the surfacing material includes (a) a stiffening layer, (b) a curable resin layer, (c) a conductive layer, and (d) a nonwoven layer, wherein the stiffening layer (a) and the nonwoven layer (d) are outermost layers, and the exposed surfaces of the outermost layers are substantially tack-free at room temperature (20° C. to 25° C.). The conductive layer may be interposed between the curable resin layer and the stiffening layer or embedded in the curable resin layer. According to another embodiment, the surfacing material includes a fluid barrier film between two curable resin layers. The surfacing materials may be in the form of a continuous or elongated tape that is suitable for automated placement.

公开(公告)号：US10906211B2

公开(公告)日：2021-02-02

申请号：US16065160

申请日：2016-12-21

Applicant: CYTEC INDUSTRIES INC.

Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli

IPC: B29C33/56 ,  B32B5/02 ,  B32B5/26 ,  B32B15/02 ,  B32B15/092 ,  B32B15/20 ,  B32B27/20 ,  B32B27/26 ,  B32B27/28 ,  B32B27/30 ,  B32B27/34 ,  B32B27/38 ,  B32B27/18 ,  B32B15/08 ,  B32B5/22 ,  B32B5/24 ,  B29C70/08

Abstract: A surfacing material that is mold-releasable and electrically conductive. This surfacing material can be co-cured with a curable composite substrate and can be in contact with a mold surface such that when the cured composite part is removed from the mold, the surfacing material is releasable from the mold with ease. The mold-releasable surfacing material can effectively eliminate the need for mold release agents and mold surface preparation.

公开(公告)号：US09620949B2

公开(公告)日：2017-04-11

申请号：US14089962

申请日：2013-11-26

Applicant: Cytec Industries Inc.

Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli

IPC: B32B15/20 ,  B32B15/14 ,  B32B5/26 ,  B32B5/12 ,  B32B5/24 ,  C08G59/38 ,  C08L63/00 ,  C09D163/00 ,  H02G13/00 ,  H05K9/00 ,  C08J5/24 ,  B32B5/02

CPC classification number: H02G13/80 ,  B32B5/022 ,  B32B5/12 ,  B32B5/26 ,  B32B15/14 ,  B32B15/20 ,  B32B37/14 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/046 ,  B32B2264/105 ,  B32B2264/107 ,  B32B2264/108 ,  B32B2305/076 ,  B32B2307/202 ,  B32B2307/536 ,  B32B2605/08 ,  B32B2605/12 ,  B32B2605/18 ,  C08G59/38 ,  C08J5/24 ,  C08K7/18 ,  C08L63/00 ,  C08L2205/02 ,  C09D163/00 ,  H05K9/0084 ,  Y10T156/1002 ,  Y10T428/249974 ,  Y10T428/252

Abstract: An electrically conductive surfacing material capable of providing sufficient conductivity for lightning strike protection (LSP) and/or electromagnetic interference (EMI) shielding is disclosed. The conductive surfacing material is a multi-layered structure having a very thin conductive layer (e.g. solid metal foil) and a resin film formed on at least one surface of the conductive layer. The resin film is formed from a curable resin composition containing an epoxy novolac resin, a tri-functional or tetra-functional epoxy resin, ceramic microspheres, a latent amine-based curing agent, particulate inorganic fillers; and a toughening component. Optionally, the resin film further includes conductive additives to increase electrical conductivity of the surfacing material. The resin film exhibits high Tg as well as high resistance to paint stripper solutions. Furthermore, the conductive surfacing material is suitable for co-curing with fiber-reinforced resin composite substrates.