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    Co-curable, conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials
    1.
    发明授权
    Co-curable, conductive surfacing films for lightning strike and electromagnetic interference shielding of thermoset composite materials 有权
    用于雷击的可共同固化的导电表面膜和热固性复合材料的电磁干扰屏蔽

    公开(公告)号：US08772391B2

    公开(公告)日：2014-07-08

    申请号：US13714506

    申请日：2012-12-14

    Applicant: Cytec Technology Corp.

    Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli

    IPC: C09D5/24

    CPC classification number: C09D5/24 ,  B82Y30/00 ,  C08K3/10 ,  C09D163/00 ,  H01B1/22 ,  H01B1/24 ,  Y10S977/742 ,  Y10S977/762 ,  Y10T156/10 ,  Y10T428/249921 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/268 ,  Y10T428/27 ,  Y10T428/273 ,  C08L2666/54

    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 mΩ/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.

    Abstract translation: 本公开的实施方案提供用于表面化膜和粘合剂的导电性，热固性组合物。 表面膜具有与金属相当的增强的电导率，而不使用嵌入的金属屏幕或箔。 作为最外表面层，这样的表面化膜可以并入到复合结构（例如，预浸料，胶带和织物）中，例如通过共固化。 特别地，发现使用银薄片作为导电填料形成的组合物表现出非常高的导电性。 例如，包含大于45wt。 ％银薄片表现出小于约55m＆OHgr / sq的电阻率。 以这种方式，当用作诸如飞行器部件的应用中时，作为最外面导电层的表面膜可以提供照明保护（LSP）和电磁干扰（EMI）屏蔽。

    Structural adhesive and bonding application thereof
    4.
    发明授权
    Structural adhesive and bonding application thereof 有权
    结构粘合剂及其结合应用

    公开(公告)号：US08974905B2

    公开(公告)日：2015-03-10

    申请号：US14512642

    申请日：2014-10-13

    Applicant: Cytec Technology Corp.

    Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli ,  Kunal Gaurang Shah

    IPC: B32B27/38 ,  B32B7/12 ,  B32B27/20 ,  B32B27/26 ,  C08G59/40 ,  C08G59/68 ,  C08K7/00 ,  C08K7/16 ,  C08K5/41 ,  C09J7/00 ,  C09J9/00 ,  C09J11/08 ,  C09J163/00 ,  B32B27/18 ,  B32B15/092

    CPC classification number: C09J163/00 ,  B32B7/12 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2264/0207 ,  B32B2270/00 ,  B32B2405/00 ,  C08G59/4253 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/5073 ,  C08K3/36 ,  C08L63/00 ,  C08L81/06 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/254 ,  Y10T428/31515 ,  Y10T428/31522 ,  C08L51/04 ,  C08L101/00

    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler as a rheology/thixotropy modifying component. The weight ratio of part (A) to part (B) is within the range of 3:2 to 10:2. In another embodiment, the structural adhesive composition is based on a one-part system which includes the components of the resinous part (A) in the two-part system mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine. The one-part system is curable within the temperature range of 140-300° F. (60-150° C.). The paste adhesive disclosed herein has film-like properties and is particularly useful in rapid-assembly aerospace structure bonding applications.

    Abstract translation: 适用于金属和航空航天结构材料的高强度粘合的结构粘合剂组合物。 在一个实施方案中，基于两部分系统的结构粘合剂组合物，其可在等于或低于200°F（93℃）下固化。 两部分系统由树脂部分（A）和催化剂部分（B）组成，可以在室温下分开储存，直到准备使用。 树脂部分（A）包括至少两种具有不同官能度的功能性多官能环氧树脂，其中二官能，三官能和四官能环氧树脂，某些增韧组分和无机填料颗粒作为流变学/触变性改良组分。 增韧组分包括具有不同粒度的核 - 壳橡胶颗粒和弹性体聚合物和聚醚砜聚合物中的至少一种。 催化剂部分（B）包括作为固化剂的脂族或环状胺化合物和作为流变/触变性改性成分的无机填料。 部分（A）与部分（B）的重量比在3:2至10:2的范围内。 在另一个实施方案中，结构粘合剂组合物基于一部分系统，其包括与潜伏胺固化剂混合的两部分体系中的树脂部分（A）的组分。 单组分体系可以进一步包括咪唑和/或脂族胺。 单组分体系可在140-300°F（60-150°C）的温度范围内固化。 本文公开的糊状粘合剂具有膜状特性，并且在快速组装航空航天结构粘合应用中特别有用。

    STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF
    6.
    发明申请
    STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF 有权
    结构粘合和粘结应用

    公开(公告)号：US20150030844A1

    公开(公告)日：2015-01-29

    申请号：US14512642

    申请日：2014-10-13

    Applicant: CYTEC TECHNOLOGY CORP.

    Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli ,  Kunal Gaurang Shah

    IPC: C09J163/00 ,  B32B27/38 ,  B32B27/18 ,  B32B7/12

    CPC classification number: C09J163/00 ,  B32B7/12 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2264/0207 ,  B32B2270/00 ,  B32B2405/00 ,  C08G59/4253 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/5073 ,  C08K3/36 ,  C08L63/00 ,  C08L81/06 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/254 ,  Y10T428/31515 ,  Y10T428/31522 ,  C08L51/04 ,  C08L101/00

    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins with different functionality selected from difunctional, trifunctional, and tetrafunctional epoxy resins, certain toughening components, and inorganic filler particles as a rheology/thixotrophy modifying component. The toughening components include core-shell rubber particles with different particle sizes and at least one of an elastomeric polymer and a polyethersulfone polymer. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler as a rheology/thixotropy modifying component. The weight ratio of part (A) to part (B) is within the range of 3:2 to 10:2. In another embodiment, the structural adhesive composition is based on a one-part system which includes the components of the resinous part (A) in the two-part system mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine. The one-part system is curable within the temperature range of 140-300° F. (60-150° C.). The paste adhesive disclosed herein has film-like properties and is particularly useful in rapid-assembly aerospace structure bonding applications.

    Abstract translation: 适用于金属和航空航天结构材料的高强度粘合的结构粘合剂组合物。 在一个实施方案中，基于两部分系统的结构粘合剂组合物，其可在等于或低于200°F（93℃）下固化。 两部分系统由树脂部分（A）和催化剂部分（B）组成，可以在室温下分开储存，直到准备使用。 树脂部分（A）包括至少两种具有不同官能度的功能性多官能环氧树脂，其中二官能，三官能和四官能环氧树脂，某些增韧组分和无机填料颗粒作为流变学/触变性改良组分。 增韧组分包括具有不同粒度的核 - 壳橡胶颗粒和弹性体聚合物和聚醚砜聚合物中的至少一种。 催化剂部分（B）包括作为固化剂的脂族或环状胺化合物和作为流变/触变性改性成分的无机填料。 部分（A）与部分（B）的重量比在3:2至10:2的范围内。 在另一个实施方案中，结构粘合剂组合物基于一部分系统，其包括与潜伏胺固化剂混合的两部分体系中的树脂部分（A）的组分。 单组分体系可以进一步包括咪唑和/或脂族胺。 单组分体系可在140-300°F（60-150°C）的温度范围内固化。 本文公开的糊状粘合剂具有膜状特性，并且在快速组装航空航天结构粘合应用中特别有用。

    STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF
    8.
    发明申请
    STRUCTURAL ADHESIVE AND BONDING APPLICATION THEREOF 有权
    结构粘合和粘结应用

    公开(公告)号：US20130115442A1

    公开(公告)日：2013-05-09

    申请号：US13652724

    申请日：2012-10-16

    Applicant: Cytec Technology Corp

    Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli ,  Kunal Gaurang Shah

    IPC: C09J163/00 ,  C08K3/36 ,  B32B7/12 ,  B82Y30/00

    CPC classification number: C09J163/00 ,  B32B7/12 ,  B32B27/18 ,  B32B27/38 ,  B32B2250/03 ,  B32B2264/0207 ,  B32B2270/00 ,  B32B2405/00 ,  C08G59/4253 ,  C08G59/50 ,  C08G59/5026 ,  C08G59/5073 ,  C08K3/36 ,  C08L63/00 ,  C08L81/06 ,  Y10T428/24995 ,  Y10T428/249951 ,  Y10T428/249952 ,  Y10T428/254 ,  Y10T428/31515 ,  Y10T428/31522 ,  C08L51/04 ,  C08L101/00

    Abstract: A structural adhesive composition that is suitable for high-strength bonding of metals and aerospace structural materials. In one embodiment, the structural adhesive composition based on a two-part system, which is curable at or below 200° F. (93° C.). The two-part system is composed of a resinous part (A) and a catalyst part (B), which may be stored separately at room temperature until they are ready to be used. The resinous part (A) includes at least two different multifunctional epoxy resins, toughening components, and inorganic filler particles. The catalyst part (B) includes an aliphatic or cyclic amine compound as a curing agent and inorganic filler. In another embodiment, the structural adhesive composition is based on a one-part system, which includes the components of the resinous part (A) mixed with a latent amine curing agent. The one-part system may further include an imidazole and/or an aliphatic amine.

    Abstract translation: 适用于金属和航空航天结构材料的高强度粘合的结构粘合剂组合物。 在一个实施方案中，基于两部分系统的结构粘合剂组合物，其可在等于或低于200°F（93℃）下固化。 两部分系统由树脂部分（A）和催化剂部分（B）组成，可以在室温下分开储存，直到准备使用。 树脂部分（A）包括至少两种不同的多官能环氧树脂，增韧组分和无机填料颗粒。 催化剂部分（B）包括脂族或环状胺化合物作为固化剂和无机填料。 在另一个实施方案中，结构粘合剂组合物基于一部分系统，其包括与潜胺胺固化剂混合的树脂部分（A）的组分。 单组分体系可以进一步包括咪唑和/或脂族胺。

    CO-CURABLE, CONDUCTIVE SURFACING FILMS FOR LIGHTNING STRIKE AND ELECTROMAGNETIC INTERFERENCE SHIELDING OF THERMOSET COMPOSITE MATERIALS
    9.
    发明申请
    CO-CURABLE, CONDUCTIVE SURFACING FILMS FOR LIGHTNING STRIKE AND ELECTROMAGNETIC INTERFERENCE SHIELDING OF THERMOSET COMPOSITE MATERIALS 有权
    热固性复合材料的耐光冲击和电磁干扰屏蔽的可固化，导电表面膜

    公开(公告)号：US20130101833A1

    公开(公告)日：2013-04-25

    申请号：US13714506

    申请日：2012-12-14

    Applicant: CYTEC TECHNOLOGY CORP.

    Inventor： Junjie Jeffrey Sang ,  Dalip Kumar Kohli

    IPC: C09D5/24

    CPC classification number: C09D5/24 ,  B82Y30/00 ,  C08K3/10 ,  C09D163/00 ,  H01B1/22 ,  H01B1/24 ,  Y10S977/742 ,  Y10S977/762 ,  Y10T156/10 ,  Y10T428/249921 ,  Y10T428/252 ,  Y10T428/254 ,  Y10T428/256 ,  Y10T428/268 ,  Y10T428/27 ,  Y10T428/273 ,  C08L2666/54

    Abstract: Embodiments of the present disclosure present electrically conductive, thermosetting compositions for use in surfacing films and adhesives. The surfacing films possess enhanced electrical conductivity, comparable to metals, without the use of embedded metal screens or foils. Such surfacing films may be incorporated into composite structures (e.g., prepregs, tapes, and fabrics), for example, by co-curing, as an outermost surface layer. In particular, compositions formed using silver flakes as conductive fillers are found to exhibit very high electrical conductivity. For example, compositions including greater than 45 wt. % silver flake exhibit resistivities less than about 55 mΩ/sq. In this manner, the surfacing films as an outermost conductive layer may provide lighting strike protection (LSP) and electromagnetic interference (EMI) shielding when used in applications such as aircraft components.

    Abstract translation: 本公开的实施方案提供用于表面化膜和粘合剂的导电性，热固性组合物。 表面膜具有与金属相当的增强的电导率，而不使用嵌入的金属屏幕或箔。 作为最外表面层，这样的表面化膜可以并入到复合结构（例如，预浸料，胶带和织物）中，例如通过共固化。 特别地，发现使用银薄片作为导电填料形成的组合物表现出非常高的导电性。 例如，包含大于45wt。 ％银薄片表现出小于约55mOmega / sq的电阻率。 以这种方式，当用作诸如飞行器部件的应用中时，作为最外面导电层的表面膜可以提供照明保护（LSP）和电磁干扰（EMI）屏蔽。

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