公开(公告)号：US08573077B2

公开(公告)日：2013-11-05

申请号：US13633142

申请日：2012-10-02

Applicant: Camtek Ltd.

Inventor： Itzik Nisany ,  Amir Gilead ,  Michael Vainer ,  Valery Nuzni

IPC: G01M19/00

CPC classification number: B65G47/905 ,  H01L21/67288 ,  H01L21/67778 ,  H01L21/6838 ,  H01L21/68707

Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.

Abstract translation: 一种用于检查晶片和系统的方法。 该系统包括：卡盘; 以及机器人，其包括连接到可拆卸式适配器的可移动元件，所述可拆卸式适配器选自切割晶片可拆卸适配器和非切割晶片可拆卸适配器的组; 其中切割的晶片可拆卸适配器成形为部分地围绕切割的晶片并且包括适于在支撑切割晶片的带上施加真空的至少一个真空槽; 并且其中所述机器人适于从盒取出所述晶片并将所述晶片放置在所述卡盘上。

公开(公告)号：US20130115030A1

公开(公告)日：2013-05-09

申请号：US13633142

申请日：2012-10-02

Applicant: Camtek Ltd.

Inventor： Itzik Nisany ,  Amir Gilead ,  Michael Vainer ,  Valery Nuzni

IPC: B65G47/90

CPC classification number: B65G47/905 ,  H01L21/67288 ,  H01L21/67778 ,  H01L21/6838 ,  H01L21/68707

Abstract: A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.

Abstract translation: 一种用于检查晶片和系统的方法。 该系统包括：卡盘; 以及机器人，其包括连接到可拆卸式适配器的可移动元件，所述可拆卸式适配器选自切割晶片可拆卸适配器和非切割晶片可拆卸适配器的组; 其中切割的晶片可拆卸适配器成形为部分地围绕切割的晶片并且包括适于在支撑切割晶片的带上施加真空的至少一个真空槽; 并且其中所述机器人适于从盒取出所述晶片并将所述晶片放置在所述卡盘上。