公开(公告)号：US20250024605A1

公开(公告)日：2025-01-16

申请号：US18771755

申请日：2024-07-12

Applicant: CelLink Corporation

Inventor： Jean-Paul Ortiz ,  Michael Nguyen ,  Malcolm Parker Brown ,  Kevin Michael Coakley ,  Robin Gorrell ,  Theodore Matthew Urdea ,  Shawn D'Gama

IPC: H05K1/11 ,  H05K1/18

Abstract: Described herein are methods for forming welded and soldered connections to flexible interconnect circuits and assemblies comprising such connections. An assembly can include a weldable transition unit having a transition pad and a solderable pad. The transition pad may comprise aluminum and can be welded to the aluminum conductive trace of a flexible interconnect circuit. The solderable pad can be soldered to the electrical contact of a device (e.g., a resistor, capacitor). In some examples, the weldable transition unit may comprise a stiffener mechanically connected to the transition pad to provide mechanical support of the transition pad and devices soldered to the transition pad. In some examples, the device soldered to the weldable transition unit may include one or more individual electronic components. In some examples, the device soldered to the weldable transition unit may be a printed circuit board (PCB) having solderable traces.