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公开(公告)号:US20250024605A1
公开(公告)日:2025-01-16
申请号:US18771755
申请日:2024-07-12
Applicant: CelLink Corporation
Inventor: Jean-Paul Ortiz , Michael Nguyen , Malcolm Parker Brown , Kevin Michael Coakley , Robin Gorrell , Theodore Matthew Urdea , Shawn D'Gama
Abstract: Described herein are methods for forming welded and soldered connections to flexible interconnect circuits and assemblies comprising such connections. An assembly can include a weldable transition unit having a transition pad and a solderable pad. The transition pad may comprise aluminum and can be welded to the aluminum conductive trace of a flexible interconnect circuit. The solderable pad can be soldered to the electrical contact of a device (e.g., a resistor, capacitor). In some examples, the weldable transition unit may comprise a stiffener mechanically connected to the transition pad to provide mechanical support of the transition pad and devices soldered to the transition pad. In some examples, the device soldered to the weldable transition unit may include one or more individual electronic components. In some examples, the device soldered to the weldable transition unit may be a printed circuit board (PCB) having solderable traces.
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公开(公告)号:US11950377B1
公开(公告)日:2024-04-02
申请号:US18300828
申请日:2023-04-14
Applicant: CelLink Corporation
Inventor: Jean-Paul Ortiz , Malcom Parker Brown , Casey Anderson , Will Findlay , Gabrielle Tate , Shawn D'Gama , Arturo Cantu-Chavez
CPC classification number: H05K3/46 , H05K1/0201 , H05K1/118 , H05K2201/10037
Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge. Otherwise, these layers are isolated from each other between the circuit edges.
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公开(公告)号:US20240215173A1
公开(公告)日:2024-06-27
申请号:US18595910
申请日:2024-03-05
Applicant: CelLink Corporation
Inventor: Jean-Paul Ortiz , Malcolm Parker Brown , Casey Anderson , Will Findlay , Gabrielle Tate , Shawn D'Gama , Arturo Cantu-Chavez
CPC classification number: H05K3/46 , H05K1/0201 , H05K1/118 , H05K2201/10037
Abstract: Provided are flexible interconnect circuits comprising signal circuit elements. For example, a signal circuit element can be formed from the same metal sheet as a signal trace, thereby being monolithic with the signal circuit element. This integration of signal circuit elements into a flexible interconnect circuit reduces the number of additional operations and components (e.g., attaching external circuit elements). In some examples, a flexible interconnect circuit is used in a battery pack for interconnecting batteries while providing external terminals on the same side of the pack. Specifically, a flexible interconnect circuit comprises an interconnecting conductive layer (for connecting to batteries) and a return conductive layer, both extending between the first and second circuit edges. Each of these conductive layers comprises a corresponding external terminal at the first edge, while these layers are interconnected at the second edge. Otherwise, these layers are isolated from each other between the circuit edges.
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