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公开(公告)号：US20220078902A1
公开(公告)日：2022-03-10
申请号：US17455386
申请日：2021-11-17
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US11516904B2
公开(公告)日：2022-11-29
申请号：US17455386
申请日：2021-11-17
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US11206730B2
公开(公告)日：2021-12-21
申请号：US16950155
申请日：2020-11-17
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20210076485A1
公开(公告)日：2021-03-11
申请号：US16950155
申请日：2020-11-17
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20200245449A1
公开(公告)日：2020-07-30
申请号：US16850340
申请日：2020-04-16
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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Patent Agency Ranking
公开(公告)号：US20240373546A1
公开(公告)日：2024-11-07
申请号：US18774682
申请日：2024-07-16
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US12052814B2
公开(公告)日：2024-07-30
申请号：US18051289
申请日：2022-10-31
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcom Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
CPC classification number: H05K1/0219 , H01B11/00 , H05K1/0237 , H05K1/028 , H05K1/0326 , H05K2201/0145
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20200137882A1
公开(公告)日：2020-04-30
申请号：US16667133
申请日：2019-10-29
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20230116550A1
公开(公告)日：2023-04-13
申请号：US18051289
申请日：2022-10-31
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcom Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US10694618B2
公开(公告)日：2020-06-23
申请号：US16667133
申请日：2019-10-29
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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