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公开(公告)号：US20240373546A1
公开(公告)日：2024-11-07
申请号：US18774682
申请日：2024-07-16
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20190051999A1
公开(公告)日：2019-02-14
申请号：US16164722
申请日：2018-10-18
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Brown , Jose Juarez , Dongao Yang
IPC: H01R12/59 , B60R16/02 , H05K1/02 , H01R43/20 , H01B7/00 , B60J5/04 , H01B7/08 , H01B7/04 , H01R12/69 , H01B7/42
CPC classification number: H01R12/592 , B60J5/0413 , B60R16/0215 , B60Y2410/115 , H01B7/0045 , H01B7/04 , H01B7/08 , H01B7/421 , H01B13/01254 , H01R12/69 , H01R43/205 , H01R2201/26 , H05K1/0201 , H05K1/028 , H05K1/118 , H05K3/0052 , H05K3/28 , H05K3/366 , H05K3/368 , H05K2201/0129 , H05K2201/0154 , H05K2201/0209 , H05K2201/041 , H05K2201/052 , H05K2201/09063 , H05K2201/10189 , H05K2203/0228
Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.
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公开(公告)号：US20230116550A1
公开(公告)日：2023-04-13
申请号：US18051289
申请日：2022-10-31
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcom Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US10694618B2
公开(公告)日：2020-06-23
申请号：US16667133
申请日：2019-10-29
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US11516904B2
公开(公告)日：2022-11-29
申请号：US17455386
申请日：2021-11-17
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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Patent Agency Ranking
公开(公告)号：US11206730B2
公开(公告)日：2021-12-21
申请号：US16950155
申请日：2020-11-17
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20210076485A1
公开(公告)日：2021-03-11
申请号：US16950155
申请日：2020-11-17
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20200245449A1
公开(公告)日：2020-07-30
申请号：US16850340
申请日：2020-04-16
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Parker Brown , Jose Juarez , Emily Hernandez , Joseph Pratt , Peter Stone , Vidya Viswanath , Will Findlay
Abstract: Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.
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公开(公告)号：US20190229449A1
公开(公告)日：2019-07-25
申请号：US16371708
申请日：2019-04-01
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Brown , Jose Juarez , Dongao Yang
IPC: H01R12/59 , H01R12/69 , H01B7/08 , H05K1/02 , B60J5/04 , H01B7/04 , B60R16/02 , H01B7/00 , H01R43/20
CPC classification number: H01R12/592 , B60J5/0413 , B60R16/0215 , B60Y2410/115 , H01B7/0045 , H01B7/04 , H01B7/08 , H01B7/421 , H01B13/01254 , H01R12/69 , H01R43/205 , H01R2201/26 , H05K1/0201 , H05K1/028 , H05K1/118 , H05K3/0052 , H05K3/28 , H05K3/366 , H05K3/368 , H05K2201/0129 , H05K2201/0154 , H05K2201/0209 , H05K2201/041 , H05K2201/052 , H05K2201/09063 , H05K2201/10189 , H05K2203/0228
Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.
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公开(公告)号：US10348009B2
公开(公告)日：2019-07-09
申请号：US16164722
申请日：2018-10-18
Applicant: CelLink Corporation
Inventor： Kevin Michael Coakley , Malcolm Brown , Jose Juarez , Dongao Yang
IPC: H01R12/59 , H05K1/02 , B60J5/04 , B60R16/02 , H01B7/00 , H01R43/20 , H01B7/04 , H01B7/08 , H01R12/69 , H01B7/42
Abstract: Provided are electrical harness assemblies and methods of forming such harness assemblies. A harness assembly comprises a conductor trace, comprising a conductor lead with a width-to-thickness ratio of at least 2. This ratio provides for a lower thickness profile and enhances heat transfer from the harness to the environment. In some examples, a conductor trace may be formed from a thin sheet of metal. The same sheet may be used to form other components of the harness. The conductor trace also comprises a connecting end, monolithic with the conductor lead. The width-to-thickness ratio of the connecting end may be less than that of the conductor trace, allowing for the connecting end to be directly mechanically and electrically connected to a connector of the harness assembly. The connecting end may be folded, shaped, slit-rearranged, and the like to reduce its width-to-thickness ratio, which may be close to 1.
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