Abstract:
A switch structure on the sidewall of a circuit board for an electronic device and manufacturing methods of the circuit board are provided. The switch structure includes a circuit board, a plurality of conductive portions, and a movable unit. The conductive portions are formed on a sidewall of the circuit board and electrically insulated from each other. The movable unit is disposed corresponding to the conductive portions to electrically connect or disconnect the plurality of conductive portions to achieve the switch function. The switch structure utilizes the structural design of the circuit board to reduce the space on the circuit board preserved for a circuit board switch.
Abstract:
A light guide includes a main body and a curved refracting face formed in the main body. As light enters the main body, a bright zone and a secondary bright zone less brighter than the bright zone are formed in the main body. The curved refracting face can be an inner wall face of a curved groove or a cavity disposed in the main body. Through the formation of the curved refracting face, the light in the secondary bright zone can be directed such that, when the light guide is disposed in a thin film keyboard, the brightness of a portion of the keyboard that corresponds to the secondary bright zone has improved brightness.
Abstract:
A container for storing semiconductor devices is revealed. The container includes a receiving body and a cover. The receiving body is disposed with at least one fastener and at least one driver therein. The fastener includes a rolling element that is in contact with the driver. When the driver is rotated, it drives the fastener to move in the receiving body. At least one fixing part of the fastener is moved toward at least one fastening part of the cover. The cover is fixed on the receiving body by the fixing part locked in the fastening part. Moreover, friction between the fastener and the driver is minimized by the rolling element which reduces contact area between the fastener and the driver so as to prevent production of contaminants in the container and protect semiconductor devices stored in the container from being polluted. Thus the container is of high cleanness.