公开(公告)号：US20140295353A1

公开(公告)日：2014-10-02

申请号：US14304988

申请日：2014-06-16

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H05K3/28

CPC classification number: H05K3/28 ,  H05K3/062 ,  H05K2201/0338

Abstract: A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. A covering layer is formed on the surface passivation layer, and the covering layer covers the surface passivation layer.

Abstract translation: 提供一种电路结构的制造方法。 提供具有上表面的金属层。 在金属层上形成表面钝化层。 表面钝化层暴露金属层的上表面的一部分，并且金属层的材料不同于表面钝化层的材料。 在表面钝化层上形成覆盖层，覆盖层覆盖表面钝化层。

公开(公告)号：US20140021154A1

公开(公告)日：2014-01-23

申请号：US13554566

申请日：2012-07-20

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: F16M13/02

CPC classification number: H05K7/1489

Abstract: A movable lug and an assistance device cooperated with the movable lug so as to replace the equipment from the rear end of the rack and avoid from being interfered by cables of other equipments. The movable lug includes a first hinge and a second hinge. The movable lug is moved inward to yield the path when replacing the equipment so that the equipment is removed and not interfered by cables of other equipments. The assistance device makes the action of the replacement of the equipment be more smooth.

Abstract translation: 可移动的凸耳和与可动凸耳配合的辅助装置，以便从机架的后端更换设备，并避免被其他设备的电缆干扰。 可移动凸耳包括第一铰链和第二铰链。 当更换设备时，可移动的凸耳向内移动以产生路径，使得设备被移除并且不被其它设备的电缆干扰。 辅助装置使得更换设备的动作更加顺畅。

公开(公告)号：US20150163908A1

公开(公告)日：2015-06-11

申请号：US14181739

申请日：2014-02-17

Applicant: Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chun-Kai Lin ,  Chao-Min Wang

Inventor： Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chun-Kai Lin ,  Chao-Min Wang

IPC: H05K1/11 ,  H05K3/42 ,  H05K3/40 ,  H05K1/09

CPC classification number: H05K1/113 ,  H05K1/115 ,  H05K3/0097 ,  H05K3/4007 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/1536 ,  H05K2203/1563 ,  Y10T29/49165

Abstract: A circuit board includes a circuit layer, a first solder resist layer, a second solder resist layer and at least one conductive bump. The first solder resist layer is disposed on a lower surface of the circuit layer and has at least one first opening exposing a portion of the lower surface of the circuit layer. The second solder resist layer is disposed on an upper surface of the circuit layer and has at least one second opening exposing a portion of the upper surface of the circuit layer. The conductive bump is disposed inside the second opening of the second solder resist layer and directly connects to the upper surface of the circuit layer exposed by the second opening. A top surface of the conductive bump is higher than a second surface of the second solder resist layer.

Abstract translation: 电路板包括电路层，第一阻焊层，第二阻焊层和至少一个导电凸块。 第一阻焊层设置在电路层的下表面上，并且具有暴露电路层的下表面的一部分的至少一个第一开口。 第二阻焊层设置在电路层的上表面上，并且具有暴露电路层的上表面的一部分的至少一个第二开口。 导电凸块设置在第二阻焊层的第二开口内，并且直接连接到由第二开口暴露的电路层的上表面。 导电凸块的顶表面高于第二阻焊层的第二表面。

公开(公告)号：US08973258B2

公开(公告)日：2015-03-10

申请号：US13600222

申请日：2012-08-31

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H05K3/20

CPC classification number: H05K3/244 ,  H05K3/42 ,  H05K3/428 ,  Y10T29/49128 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49169

Abstract: A manufacturing method of substrate structure is provided. A base material having a core layer, a first patterned copper layer, a second patterned copper layer and at least one conductive via is provided. The first and second patterned copper layers are respectively located on a first surface and a second surface of the core layer. The conductive via passes through the core layer and connects the first and second patterned copper layers. A first and a second solder mask layers are respectively formed on the first and second surfaces. Portions of the first and second patterned copper layers are exposed by the first and second solder mask layers, respectively. A first gold layer is formed on the first and second patterned copper layers exposed by the first and second solder mask layers. A nickel layer and a second gold layer are successively formed on the first gold layer.

Abstract translation: 提供了一种基板结构的制造方法。 提供具有芯层，第一图案化铜层，第二图案化铜层和至少一个导电通孔的基材。 第一和第二图案化铜层分别位于芯层的第一表面和第二表面上。 导电通孔穿过芯层并连接第一和第二图案化的铜层。 第一和第二焊料掩模层分别形成在第一和第二表面上。 第一和第二图案化铜层的部分分别由第一和第二焊料掩模层暴露。 在由第一和第二焊料掩模层暴露的第一和第二图案化铜层上形成第一金层。 在第一金层上依次形成镍层和第二金层。

公开(公告)号：US09036368B2

公开(公告)日：2015-05-19

申请号：US13546503

申请日：2012-07-11

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H02G3/04

CPC classification number: H02G3/045 ,  H02G3/0418

Abstract: A cable management device used in a chassis includes a frame and two board-like cable management units are respectively connected to two sides of the frame. Each cable management unit has multiple recesses. The cables of each of the ports are located in the corresponding recesses to avoid the cables from being in contact with each other and have better heat dissipating feature.

Abstract translation: 在机架中使用的电缆管理装置包括框架，并且两个板状电缆管理单元分别连接到框架的两侧。 每个电缆管理单元都有多个凹槽。 每个端口的电缆位于相应的凹槽中，以避免电缆彼此接触并具有更好的散热特征。

公开(公告)号：US08853102B2

公开(公告)日：2014-10-07

申请号：US13961844

申请日：2013-08-07

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: H01L21/00 ,  H05K3/06 ,  B82Y10/00 ,  H01L21/768

CPC classification number: H01L21/7685 ,  B82Y10/00 ,  H05K3/062 ,  H05K2201/0338

Abstract: A manufacturing method of a circuit structure is provided. A metal layer having an upper surface is provided. A surface passivation layer is formed on the metal layer. The surface passivation layer exposes a portion of the upper surface of the metal layer, and a material of the metal layer is different from a material of the surface passivation layer. The metal layer and the surface passivation layer are dipped into a modifier, and the modifier is selectively absorbed and attached to the surface passivation layer, so as to form a covering layer. The covering layer has a plurality of nanoparticles and covers the surface passivation layer.

Abstract translation: 提供一种电路结构的制造方法。 提供具有上表面的金属层。 在金属层上形成表面钝化层。 表面钝化层暴露金属层的上表面的一部分，并且金属层的材料不同于表面钝化层的材料。 将金属层和表面钝化层浸入改性剂中，并且改性剂被选择性地吸收并附着到表面钝化层，以形成覆盖层。 覆盖层具有多个纳米颗粒并覆盖表面钝化层。

公开(公告)号：US20120070684A1

公开(公告)日：2012-03-22

申请号：US13046785

申请日：2011-03-14

Applicant: Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chien-Hung Wu

Inventor： Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chien-Hung Wu

IPC: B32B15/04 ,  B32B38/00 ,  C25D5/16 ,  B32B37/00

CPC classification number: C25D5/16 ,  B32B15/08 ,  B32B37/02 ,  B32B2307/302 ,  B32B2457/08 ,  C25D5/10 ,  H01L2924/0002 ,  H05K1/05 ,  H05K3/421 ,  H05K2201/0338 ,  Y10T428/12535 ,  H01L2924/00

Abstract: A thermal conductivity substrate including a metal substrate, a metal layer, an insulating layer, a plurality of conductive structures, a first conductive layer and a second conductive layer is provided. The metal layer is disposed on the metal substrate and entirely covers the metal substrate. The insulating layer is disposed on the metal layer. The conductive structures are embedded in the insulating layer and connected to a portion of the metal layer. The first conductive layer is disposed on the insulating layer. The second conductive layer is disposed on the first conductive layer and the conductive structures. The second conductive layer is electrically connected to a portion of the metal layer through the conductive structures. The second conductive layer and the conductive structures are integrally formed.

Abstract translation: 提供了包括金属基板，金属层，绝缘层，多个导电结构，第一导电层和第二导电层的导热性基板。 金属层设置在金属基板上，完全覆盖金属基板。 绝缘层设置在金属层上。 导电结构嵌入在绝缘层中并连接到金属层的一部分。 第一导电层设置在绝缘层上。 第二导电层设置在第一导电层和导电结构上。 第二导电层通过导电结构电连接到金属层的一部分。 第二导电层和导电结构整体形成。

公开(公告)号：US09204546B2

公开(公告)日：2015-12-01

申请号：US14181739

申请日：2014-02-17

Applicant: Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chun-Kai Lin ,  Chao-Min Wang

Inventor： Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chun-Kai Lin ,  Chao-Min Wang

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/00

CPC classification number: H05K1/113 ,  H05K1/115 ,  H05K3/0097 ,  H05K3/4007 ,  H05K2201/0376 ,  H05K2201/09509 ,  H05K2201/0959 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/1536 ,  H05K2203/1563 ,  Y10T29/49165

Abstract: A circuit board includes a circuit layer, a first solder resist layer, a second solder resist layer and at least one conductive bump. The first solder resist layer is disposed on a lower surface of the circuit layer and has at least one first opening exposing a portion of the lower surface of the circuit layer. The second solder resist layer is disposed on an upper surface of the circuit layer and has at least one second opening exposing a portion of the upper surface of the circuit layer. The conductive bump is disposed inside the second opening of the second solder resist layer and directly connects to the upper surface of the circuit layer exposed by the second opening. A top surface of the conductive bump is higher than a second surface of the second solder resist layer.

Abstract translation: 电路板包括电路层，第一阻焊层，第二阻焊层和至少一个导电凸块。 第一阻焊层设置在电路层的下表面上，并且具有暴露电路层的下表面的一部分的至少一个第一开口。 第二阻焊层设置在电路层的上表面上，并且具有暴露电路层的上表面的一部分的至少一个第二开口。 导电凸块设置在第二阻焊层的第二开口内，并且直接连接到由第二开口暴露的电路层的上表面。 导电凸块的顶表面高于第二阻焊层的第二表面。

公开(公告)号：US20150144315A1

公开(公告)日：2015-05-28

申请号：US14153094

申请日：2014-01-13

Applicant: Ching-Sheng Chen

Inventor： Ching-Sheng Chen

IPC: F28F3/12

CPC classification number: F28F3/12 ,  F28D15/0233 ,  F28D15/04 ,  F28F3/02 ,  F28F13/00 ,  F28F2255/02

Abstract: A heat dissipation substrate includes a heat sink, a metal base and an elastic structure. The heat sink includes a carrying portion and supporting portions. The supporting portions are parallel to one another and disposed on a lower surface of the carrying portion. The supporting portions are perpendicular to the carrying portion and surround an accommodating space with the carrying portion. The carrying portion has first rough surface structure disposed on a portion of the lower surface and located in the accommodating space. The metal base is disposed below the heat sink and has an assemble surface and a second rough surface structure disposed on a portion of the assemble surface and corresponding to the first rough surface structure. The first and second rough surface structures and the supporting portions define a fluid chamber in which the elastic structure is disposed, and a working fluid flows in the fluid chamber.

Abstract translation: 散热基板包括散热器，金属基座和弹性结构。 散热器包括承载部分和支撑部分。 支撑部分彼此平行并且设置在承载部分的下表面上。 支撑部分垂直于承载部分并且围绕着具有承载部分的容纳空间。 承载部分具有设置在下表面的一部分上并位于容纳空间中的第一粗糙表面结构。 金属基座设置在散热器的下方，并具有组装表面和设置在组装表面的一部分上并对应于第一粗糙表面结构的第二粗糙表面结构。 第一和第二粗糙表面结构和支撑部分限定了其中布置有弹性结构的流体室，并且工作流体在流体室中流动。

公开(公告)号：US20150092358A1

公开(公告)日：2015-04-02

申请号：US14072803

申请日：2013-11-06

Applicant: Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chao-Min Wang

Inventor： Chin-Sheng Wang ,  Ching-Sheng Chen ,  Chao-Min Wang

IPC: H05K1/11

CPC classification number: H05K3/007 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2924/15311 ,  H05K3/3452 ,  H05K2201/0376 ,  H05K2203/0156 ,  H01L2924/00014

Abstract: A package carrier including a removable supporting plate and a circuit board is provided. The removable supporting plate includes a dielectric layer, a copper foil layer and a releasing layer. The dielectric layer is disposed between the copper foil layer and the releasing layer. The circuit board is disposed on the removable supporting plate and directly contacts the releasing layer. A thickness of the circuit board is between 30 μm and 100 μm.

Abstract translation: 提供一种包括可拆卸支撑板和电路板的封装载体。 可移除的支撑板包括介电层，铜箔层和释放层。 介电层设置在铜箔层和释放层之间。 电路板设置在可拆卸的支撑板上并直接接触释放层。 电路板的厚度在30μm和100μm之间。