公开(公告)号：US20060226534A1

公开(公告)日：2006-10-12

申请号：US11378283

申请日：2006-03-20

Applicant: Kuei-Chen Liang ,  Chung-Ju Wu ,  Chung-Yin Fang

Inventor： Kuei-Chen Liang ,  Chung-Ju Wu ,  Chung-Yin Fang

IPC: H01L23/04 ,  H01L21/44

CPC classification number: H01L24/29 ,  H01L23/3128 ,  H01L23/50 ,  H01L23/552 ,  H01L23/60 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L2223/6611 ,  H01L2224/05554 ,  H01L2224/27013 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/8592 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/10161 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43

Abstract: A packaging structure and an assembly method are disclosed. A packaging structure includes a substrate, a die, conductive wires, and conductively filled material. The substrate includes a conductive structure, and the conductive wires are insulator-coated. The die is mounted on the substrate, and the conductive wires are connected between the die and the conductive structure. The conductively filled material is formed among the conductive wires. In the assembly method, the die is firstly mounted on the substrate, followed by connecting the conductive wires between the die and the conductive structure, and finally forming the conductively filled material among the conductive wires.

Abstract translation: 公开了一种包装结构和装配方法。 封装结构包括基片，裸片，导线和导电填充材料。 衬底包括导电结构，并且导电线被绝缘体涂覆。 芯片安装在基板上，并且导线连接在管芯和导电结构之间。 导电填充材料形成在导线之间。 在组装方法中，首先将模具安装在基板上，然后将导线连接在管芯和导电结构之间，最后在导线之间形成导电填充材料。

公开(公告)号：US20140071062A1

公开(公告)日：2014-03-13

申请号：US13614890

申请日：2012-09-13

Applicant: Chung-Yin Fang

Inventor： Chung-Yin Fang

IPC: G06F3/041

CPC classification number: G06F3/0416

Abstract: A method for increasing touch sampling rate and a touch display device using the same are provided, wherein the touch display device comprises a timing controller and a display panel. A timing control signal is provided by the timing controller. Each cycle of the timing control signal comprises a blanking period and a frame period, every N frame periods correspond to one image frame of a video signal, and every N blanking periods and every N frame periods correspond to one cycle of the video signal, where N is a positive integer larger than 1. Through the timing control signal, the touch display device arranges the timing for driving the display panel to display frame images and to sense touch, whereby increasing the touch sampling rate thereof.

Abstract translation: 提供一种增加触摸采样率的方法和使用其的触摸显示装置，其中触摸显示装置包括定时控制器和显示面板。 定时控制信号由定时控制器提供。 定时控制信号的每个周期包括消隐周期和帧周期，每N个帧周期对应于视频信号的一个图像帧，并且每N个消隐周期和每N个帧周期对应于视频信号的一个周期，其中 N是大于1的正整数。通过定时控制信号，触摸显示装置布置用于驱动显示面板的定时以显示帧图像并感测触摸，从而增加其触摸采样率。