公开(公告)号：US20150023377A1

公开(公告)日：2015-01-22

申请号：US14510654

申请日：2014-10-09

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu SHASTRI ,  Soham PATHAK ,  Vipulkumar PATEL ,  Bipin DAMA ,  Kishor DESAI

IPC: H01S5/024 ,  H01S5/022 ,  H01S5/40 ,  H01S5/00

CPC classification number: H01S5/02415 ,  G02B6/42 ,  G02B6/4273 ,  H01S5/005 ,  H01S5/0064 ,  H01S5/02248 ,  H01S5/024 ,  H01S5/02469 ,  H01S5/4025

Abstract: An interposer (support substrate) for an opto-electronic assembly is formed to include a thermally-isolated region where temperature-sensitive devices (such as, for example, laser diodes) may be positioned and operate independent of temperature fluctuations in other areas of the assembly. The thermal isolation is achieved by forming a boundary of dielectric material through the thickness of the interposer, the periphery of the dielectric defining the boundary between the thermally isolated region and the remainder of the assembly. A thermo-electric cooler can be used in conjunction with the temperature-sensitive device(s) to stabilize the operation of these devices.

Abstract translation: 形成用于光电组件的插入器（支撑衬底），以包括热隔离区域，其中可以将温度敏感器件（例如激光二极管）定位并独立于其中的温度波动 部件。 通过形成介电材料的边界通过插入件的厚度来实现热隔离，绝缘体的外围限定了热隔离区域和组件的其余部分之间的边界。 热电冷却器可与温度敏感设备结合使用，以稳定这些设备的运行。

公开(公告)号：US20150277068A1

公开(公告)日：2015-10-01

申请号：US14687119

申请日：2015-04-15

Applicant: Cisco Technology, Inc.

Inventor： Kishor DESAI ,  Ravinder Kachru ,  Vipulkumar Patel ,  Bipin Dama ,  Kalpendu Shastri ,  Soham Pathak

IPC: G02B6/42 ,  G02B6/13

CPC classification number: G02B6/4255 ,  G02B6/12 ,  G02B6/13 ,  G02B6/4201 ,  G02B6/4257 ,  G02B6/4292 ,  G02B6/43 ,  H01L21/50 ,  H01L23/04 ,  H01L23/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L33/52 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/165 ,  H01L2924/16788 ,  H05K1/0268 ,  H05K1/0274 ,  H05K2201/10121 ,  H01L2924/0105 ,  H01L2924/01079

Abstract: An opto-electronic assembly is provided comprising a substrate (generally of silicon or glass) for supporting a plurality of interconnected optical and electrical components. A layer of sealing material is disposed to outline a defined peripheral area of the substrate. A molded glass lid is disposed over and bonded to the substrate, where the molded glass lid is configured to create a footprint that matches the defined peripheral area of the substrate. The bottom surface of the molded glass lid includes a layer of bonding material that contacts the substrate's layer of sealing material upon contact, creating a bonded assembly. In one form, a wafer level assembly process is proposed where multiple opto-electronic assemblies are disposed on a silicon wafer and multiple glass lids are molded in a single sheet of glass that is thereafter bonded to the silicon wafer.

Abstract translation: 提供了一种光电子组件，其包括用于支撑多个互连的光学和电气部件的基板（通常为硅或玻璃）。 设置一层密封材料以概述衬底的限定的周边区域。 将模制的玻璃盖设置在基底上并结合到基底上，其中模制的玻璃盖构造成产生与限定的基底周边区域匹配的覆盖区。 模制玻璃盖的底表面包括一层接合材料，其在接触时接触基底的密封材料层，形成结合组件。 在一种形式中，提出了一种晶片级组装工艺，其中多个光电组件设置在硅晶片上，并且多个玻璃盖被模制在一片玻璃中，然后将其粘合到硅晶片上。

公开(公告)号：US20140169734A1

公开(公告)日：2014-06-19

申请号：US13715962

申请日：2012-12-14

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Ravinder KACHRU ,  Chris TOGAMI ,  Kishor DESAI

IPC: G02B6/42 ,  G02B6/32

CPC classification number: G02B6/4226 ,  G02B6/32 ,  G02B6/42 ,  G02B6/4206 ,  G02B6/4214 ,  G02B7/005 ,  H04B10/2503 ,  H04B10/516

Abstract: Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses and an array of optical fiber ferrules held into alignment by a lens holder sub-assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub-assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror or prism used to direct light into the lens holder sub-assembly.

Abstract translation: 描述了将光从波导阵列耦合到单模光纤阵列的技术。 在一个实施例中，聚焦透镜阵列的横向偏移和由透镜保持器子组件保持对准的光纤套圈阵列通过相对于被耦合的光的传播轴倾斜透镜保持器子组件来补偿 通过镜头架子组件。 由于可以根据横向偏移的程度来调节倾斜量，所以可以利用以不同程度的不对准制造的透镜保持器子组件将光耦合到单模光纤电缆中。 此外，也可以使用相同的技术来补偿其他缺陷，例如用于将光引导到透镜保持器子组件中的转向镜或棱镜的制造或放置中的角度误差。

公开(公告)号：US20160161684A1

公开(公告)日：2016-06-09

申请号：US15045540

申请日：2016-02-17

Applicant: Cisco Technology, Inc.

Inventor： Ravinder KACHRU ,  Chris TOGAMI ,  Kishor DESAI

IPC: G02B6/42 ,  G02B6/38 ,  H04B10/25 ,  H04B10/079 ,  H04B10/516 ,  G02B6/32 ,  G02B7/00

CPC classification number: G02B6/4226 ,  G02B6/32 ,  G02B6/42 ,  G02B6/4206 ,  G02B6/4214 ,  G02B7/005 ,  H04B10/2503 ,  H04B10/516

Abstract: Techniques for coupling light from a waveguide array to a single mode fiber array are described. In an embodiment, lateral misalignment of an array of focusing lenses and an array of optical fiber ferrules held into alignment by a lens holder sub-assembly is compensated by tilting the lens holder sub-assembly with respect to the propagation axis of the light being coupled by the lens holder-subassembly. Since the amount of tilt can be adjusted according to the degree of lateral misalignment, lens holder sub-assemblies manufactured with varying degrees of misalignment may be utilized to couple light into single mode fiber-optic cable. In addition, the same technique can also be used to compensate for other defects as well, such as angular errors in manufacturing or placement of a turning mirror or prism used to direct light into the lens holder sub-assembly.

Abstract translation: 描述了将光从波导阵列耦合到单模光纤阵列的技术。 在一个实施例中，聚焦透镜阵列的横向偏移和由透镜保持器子组件保持对准的光纤套圈阵列通过相对于被耦合的光的传播轴倾斜透镜保持器子组件来补偿 通过镜头架子组件。 由于可以根据横向偏移的程度来调节倾斜量，所以可以利用以不同程度的不对准制造的透镜保持器子组件将光耦合到单模光纤电缆中。 此外，也可以使用相同的技术来补偿其他缺陷，例如用于将光引导到透镜保持器子组件中的转向镜或棱镜的制造或放置中的角度误差。

公开(公告)号：US20150016784A1

公开(公告)日：2015-01-15

申请号：US14498669

申请日：2014-09-26

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu SHASTRI ,  Soham PATHAK ,  Utpal CHAKRABARTI ,  Vipulkumar PATEL ,  Bipin DAMA ,  Ravinder KACHRU ,  Kishor DESAI

IPC: G02B6/42

CPC classification number: G02B6/4292 ,  B82Y20/00 ,  C03C15/00 ,  G02B6/136 ,  G02B6/4214 ,  G02B6/4246 ,  G02B6/4259 ,  Y10T29/4978

Abstract: An apparatus for providing self-aligned optical coupling between an opto-electronic substrate and a fiber array, where the substrate is enclosed by a transparent lid such that the associated optical signals enter and exit the arrangement through the transparent lid. The apparatus takes the form of a two-part connectorized fiber array assembly where the two pieces uniquely mate to form a self-aligned configuration. A first part, in the form of a plate, is attached to the transparent lid in the area where the optical signals pass through. The first plate includes a central opening with inwardly-tapering sidewalls surrounding its periphery. A second plate is also formed to include a central opening and has a lower protrusion with inwardly-tapering sidewalls that mate with the inwardly-tapering sidewalls of the first plate to form the self-aligned connectorized fiber array assembly. The fiber array is then attached to the second plate in a self-aligned fashion.

Abstract translation: 一种用于在光电子基板和光纤阵列之间提供自对准光耦合的装置，其中基板由透明盖包围，使得相关联的光信号通过透明盖进入和离开布置。 该装置采取两部分连接的光纤阵列组件的形式，其中两个部件独特地配合以形成自对准配置。 在光信号通过的区域中，透明盖附着有板的形式的第一部分。 第一板包括具有围绕其周边的向内逐渐变细的侧壁的中心开口。 第二板也形成为包括中心开口并且具有下突起，其具有向内渐缩的侧壁，与第一板的向内渐缩的侧壁配合形成自对准的连接纤维阵列组件。 然后将纤维阵列以自对准的方式附接到第二板。

公开(公告)号：US20160209606A1

公开(公告)日：2016-07-21

申请号：US14339921

申请日：2014-07-24

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Kalpendu SHASTRI ,  Ravinder KACHRU ,  Kishor DESAI

IPC: G02B6/42 ,  G02B6/136 ,  G02B6/12

CPC classification number: G02B6/423 ,  G01B11/14 ,  G02B6/4239 ,  G02B6/4249

Abstract: An arrangement for providing passive alignment of optical components on a common substrate uses a set of reference cavities, where each optical device is positioned within a separate reference cavity. The reference cavities are formed to have a predetermined depth, with perimeters slightly larger than the footprint of their associated optical components. The reference cavity includes at least one right-angle corner that is used as a registration corner against which a right-angle corner of an associated optical component is positioned. The placement of each optical component in its own reference cavity allows for passive optical alignment to be achieved by placing each component against its predefined registration corner.

Abstract translation: 用于在公共衬底上提供光学部件的被动对准的装置使用一组参考腔，其中每个光学装置定位在单独的参考腔内。 参考空腔形成为具有预定深度，其周长稍大于其相关联的光学部件的覆盖区。 参考腔包括至少一个直角角，其被用作相关联的光学部件的直角角位于其上的配准角。 每个光学部件在其自己的参考腔中的放置允许通过将每个部件放置在其预定义的配准角上来实现无源光学对准。

公开(公告)号：US20140248723A1

公开(公告)日：2014-09-04

申请号：US14276566

申请日：2014-05-13

Applicant: Cisco Technology, Inc.

Inventor： Kalpendu SHASTRI ,  Vipulkumar PATEL ,  Mark WEBSTER ,  Prakash GOTHOSKAR ,  Ravinder KACHRU ,  Soham PATHAK ,  Rao V. YELAMARTY ,  Thomas DAUGHERTY ,  Bipin DAMA ,  Kaushik PATEL ,  Kishor DESAI

IPC: H01L25/00 ,  H01L25/16

CPC classification number: H01L25/50 ,  G02B6/423 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4249 ,  G02B6/4257 ,  G02B6/426 ,  H01L25/167 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014

Abstract: A wafer scale implementation of an opto-electronic transceiver assembly process utilizes a silicon wafer as an optical reference plane and platform upon which all necessary optical and electronic components are simultaneously assembled for a plurality of separate transceiver modules. In particular, a silicon wafer is utilized as a “platform” (interposer) upon which all of the components for a multiple number of transceiver modules are mounted or integrated, with the top surface of the silicon interposer used as a reference plane for defining the optical signal path between separate optical components. Indeed, by using a single silicon wafer as the platform for a large number of separate transceiver modules, one is able to use a wafer scale assembly process, as well as optical alignment and testing of these modules.

Abstract translation: 光电子收发器组件过程的晶片级实现利用硅晶片作为光学参考平面和平台，同时为多个单独的收发器模块组装所有必需的光学和电子部件。 特别地，硅晶片被用作“平台”（插入器），在其上安装或集成多个收发器模块的所有组件，硅插入器的顶表面用作参考平面，用于定义 分离光学元件之间的光信号路径。 实际上，通过使用单个硅晶片作为大量单独的收发器模块的平台，可以使用晶片尺度组装过程以及这些模块的光学对准和测试。