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公开(公告)号：US11445312B2
公开(公告)日：2022-09-13
申请号：US16745942
申请日：2020-01-17
Applicant: Cochlear Limited
Inventor： Jan Vermeiren , Kristof Buytaert , Rishubh Verma
Abstract: Wires and coils within an electrode assembly electromagnetically interact and cause mechanical motion of the assembly. This mechanical motion can be used to supplement or replace the electrical stimulation provided by a standard cochlear implant and provides targeted acoustic stimulation to the cochlea.
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公开(公告)号：US11223912B2
公开(公告)日：2022-01-11
申请号：US15656181
申请日：2017-07-21
Applicant: Cochlear Limited
Inventor： Jan Vermeiren , Travis Rian Andrews
Abstract: A vibrator including a housing, a transducer positioned within the housing such that there is a gap between the transducer and housing, and a damper assembly, disposed in the gap between the housing and at least a portion of the transducer, the damper assembly extending a sub-distance of the total distance of the gap.
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公开(公告)号：US20210297795A1
公开(公告)日：2021-09-23
申请号：US17257832
申请日：2019-10-22
Applicant: Cochlear Limited
Inventor： Jan Vermeiren , Koen Erik Van den Heuvel , Rishubh Verma , Antonin Rambault
Abstract: An apparatus is provided which includes a biocompatible housing configured to be implanted within a recipient. The housing includes a unitary wall including a first wall portion and a second wall portion surrounding a perimeter of the first wall portion. The first wall portion is sufficiently flexible to transmit vibrations between an outer region outside the housing and an inner region within the housing.
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公开(公告)号：US12207054B2
公开(公告)日：2025-01-21
申请号：US17257832
申请日：2019-10-22
Applicant: Cochlear Limited
Inventor： Jan Vermeiren , Koen Erik Van den Heuvel , Rishubh Verma , Antonin Rambault
Abstract: An apparatus is provided which includes a biocompatible housing configured to be implanted within a recipient. The housing includes a unitary wall including a first wall portion and a second wall portion surrounding a perimeter of the first wall portion. The first wall portion is sufficiently flexible to transmit vibrations between an outer region outside the housing and an inner region within the housing.
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公开(公告)号：US11889670B2
公开(公告)日：2024-01-30
申请号：US17293447
申请日：2020-04-01
Applicant: Cochlear Limited
Inventor： Tom Meeusen , Koen Erik Van den Heuvel , Jan Vermeiren , Stijn Eeckhoudt
CPC classification number: H05K9/0024 , A61N1/36038 , H04R25/606 , H04R25/609 , H04R25/65 , H05K1/111 , H05K9/0064 , H05K9/0067 , H04R2201/003 , H04R2225/67 , H05K2201/10151
Abstract: An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.
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Patent Agency Ranking
公开(公告)号：US12101602B2
公开(公告)日：2024-09-24
申请号：US18070928
申请日：2022-11-29
Applicant: Cochlear Limited
Inventor： Koen Erik Van den Heuvel , Jan Vermeiren , Rishubh Verma , Antonin Rambault
CPC classification number: H04R25/604 , H04R25/609 , H04R25/65 , A61N1/36038 , A61N1/36128 , H04R2225/67
Abstract: Presented herein are implantable sound sensors that include a non-uniform diaphragm mechanically coupled to a vibrating structure of a recipient's middle or inner ear. The non-uniform diaphragm includes a central region and a peripheral region, where the thickness of the central region is greater than the thickness of the peripheral region.
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公开(公告)号：US20240196577A1
公开(公告)日：2024-06-13
申请号：US18544174
申请日：2023-12-18
Applicant: Cochlear Limited
Inventor： Tom Meeusen , Koen Erik Van den Heuvel , Jan Vermeiren , Stijn Eeckhoudt
CPC classification number: H05K9/0024 , A61N1/36038 , H04R25/606 , H04R25/609 , H04R25/65 , H05K1/111 , H05K9/0064 , H05K9/0067 , H04R2201/003 , H04R2225/67 , H05K2201/10151
Abstract: An assembly is provided which includes a package and a printed circuit board. The package includes a housing bounding a region and an acoustic sensor within the region. The housing includes a base with a first hole. The sensor is configured to generate signals indicative of sound received by the sensor through the first hole. The printed circuit board is in mechanical communication with the base and includes a second hole aligned with the first hole such that sound received by the second hole propagates through the first hole to the sensor. The printed circuit board further includes an electrically conductive layer, at least a portion of which extends across the second hole and is configured to allow the sound to propagate through the second hole and to at least partially shield the region containing the sensor from electromagnetic interference.
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公开(公告)号：US20230156415A1
公开(公告)日：2023-05-18
申请号：US18070928
申请日：2022-11-29
Applicant: Cochlear Limited
Inventor： Koen Erik Van den Heuvel , Jan Vermeiren , Rishubh Verma , Antonin Rambault
IPC: H04R25/00
CPC classification number: H04R25/604 , H04R25/65 , H04R25/609 , A61N1/36038
Abstract: Presented herein are implantable sound sensors that include a non-uniform diaphragm mechanically coupled to a vibrating structure of a recipient’s middle or inner ear. The non-uniform diaphragm includes a central region and a peripheral region, where the thickness of the central region is greater than the thickness of the peripheral region.
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公开(公告)号：US10798502B2
公开(公告)日：2020-10-06
申请号：US15299703
申请日：2016-10-21
Applicant: Cochlear Limited
Inventor： Jan Vermeiren
IPC: H04R25/00
Abstract: Embodiments are generally directed to implantable transducer systems for implantable hearing prostheses. The implantable transducer systems in accordance with embodiments presented herein include a transducer and an expandable fixation arrangement, such as a radially expandable fixation arrangement, that is configured to anchor/secure the implantable transducer system directly within an elongate cannular cavity extending through a portion of a recipient's skull bone.
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公开(公告)号：US20200260200A1
公开(公告)日：2020-08-13
申请号：US16745942
申请日：2020-01-17
Applicant: Cochlear Limited
Inventor： Jan Vermeiren , Kristof Buytaert , Rishubh Verma
Abstract: Wires and coils within an electrode assembly electromagnetically interact and cause mechanical motion of the assembly. This mechanical motion can be used to supplement or replace the electrical stimulation provided by a standard cochlear implant and provides targeted acoustic stimulation to the cochlea.
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