公开(公告)号：US20190116502A1

公开(公告)日：2019-04-18

申请号：US16163667

申请日：2018-10-18

Applicant: CommScope Technologies LLC

Inventor： Pengfei Guo ,  Ligang Wu ,  Hangsheng Wen ,  Jun Sun

IPC: H04W16/28 ,  H04B7/0408 ,  H01Q1/24 ,  H01Q21/06

Abstract: An antenna assembly includes a substrate having front and back surfaces thereon and a plurality of through-holes therein, along with a solder pad on the back surface of the substrate. An input cable is also provided, which is attached to the back surface of the substrate. The input cable includes an outer conductor, which contacts the back surface of the substrate, and an inner conductor, which extends at least partially through a first of the plurality of through-holes and is electrically connected to the solder pad. A metal trace (e.g., 50-ohm trace) is provided on the front surface of the substrate. The metal trace is electrically connected to the solder pad by electrically conductive plating in a second of the plurality of through-holes.

公开(公告)号：US20190326663A1

公开(公告)日：2019-10-24

申请号：US16372771

申请日：2019-04-02

Applicant: CommScope Technologies LLC

Inventor： Maosheng Liu ,  ZhaoHui Liu ,  PuLiang Tang ,  Ruixin Su ,  Jun Sun ,  Junfeng Yu

IPC: H01Q1/24 ,  H01Q3/36 ,  H01Q21/06

Abstract: A linkage device of a linkage mechanism for a base station antenna is integrally formed with: a body; a flange extending outwardly from the body; a mounting portion suspended from the body and configured to mount the linkage device into the base station antenna, and a coupling portion disposed on the body and configured to couple the linkage device to a drive mechanism of the base station antenna, wherein the flange is formed with a guide configured to cause operation of a phase shifter of the base station antenna.

公开(公告)号：US20200229000A9

公开(公告)日：2020-07-16

申请号：US16163667

申请日：2018-10-18

Applicant: CommScope Technologies LLC

Inventor： Pengfei Guo ,  Ligang Wu ,  Hangsheng Wen ,  Jun Sun

IPC: H04W16/28 ,  H04B7/0408 ,  H01Q1/24 ,  H01Q21/06

Abstract: An antenna assembly includes a substrate having front and back surfaces thereon and a plurality of through-holes therein, along with a solder pad on the back surface of the substrate. An input cable is also provided, which is attached to the back surface of the substrate. The input cable includes an outer conductor, which contacts the back surface of the substrate, and an inner conductor, which extends at least partially through a first of the plurality of through-holes and is electrically connected to the solder pad. A metal trace (e.g., 50-ohm trace) is provided on the front surface of the substrate. The metal trace is electrically connected to the solder pad by electrically conductive plating in a second of the plurality of through-holes.

公开(公告)号：US10694397B2

公开(公告)日：2020-06-23

申请号：US16163667

申请日：2018-10-18

Applicant: CommScope Technologies LLC

Inventor： Pengfei Guo ,  Ligang Wu ,  Hangsheng Wen ,  Jun Sun

IPC: H04M1/00 ,  H04W16/28 ,  H01Q21/06 ,  H01Q1/24 ,  H04B7/0408 ,  H01P5/08

Abstract: An antenna assembly includes a substrate having front and back surfaces thereon and a plurality of through-holes therein, along with a solder pad on the back surface of the substrate. An input cable is also provided, which is attached to the back surface of the substrate. The input cable includes an outer conductor, which contacts the back surface of the substrate, and an inner conductor, which extends at least partially through a first of the plurality of through-holes and is electrically connected to the solder pad. A metal trace (e.g., 50-ohm trace) is provided on the front surface of the substrate. The metal trace is electrically connected to the solder pad by electrically conductive plating in a second of the plurality of through-holes.