公开(公告)号：US20160029485A1

公开(公告)日：2016-01-28

申请号：US14337377

申请日：2014-07-22

Applicant: Cree, Inc.

Inventor： Andrew K. Dummer

IPC: H05K1/11 ,  B23K1/20 ,  F21K99/00 ,  H05K3/34 ,  H05K1/18 ,  B23K1/00 ,  B23K31/02

CPC classification number: H05K1/111 ,  B23K1/0016 ,  B23K1/20 ,  B23K31/02 ,  H01L2224/16225 ,  H05K1/0295 ,  H05K1/181 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2203/04 ,  H05K2203/048 ,  Y02P70/611

Abstract: Solder pads, systems, and related methods are provided. A first or second pad include at least one shape for increasing a number of edges available to align at least one part to be soldered thereto. Each solder pad can occupy a same surface area of the substrate. A plurality of circuit elements can be provided over the plurality of solder pads, where some of the circuit elements occupy different surface areas of the substrate and/or the solder pad. A method of providing a solder pad includes providing a substrate, providing a solder pad over the substrate, and providing at least one shape in the solder pad for increasing a number of edges available to align at least one part to be soldered thereto. The pads can attach for example to a surface-mount ceramic component, a submount-free component, a leadframe component and/or a chip on board component.

Abstract translation: 提供焊盘，系统和相关方法。 第一或第二焊盘包括用于增加可用于对准待焊接到其上的至少一个部件的边缘的数量的至少一个形状。 每个焊盘可以占据基板的相同表面积。 多个电路元件可以设置在多个焊盘上，其中一些电路元件占据基板和/或焊盘的不同表面积。 提供焊盘的方法包括提供衬底，在衬底上提供焊盘，并在焊盘中提供至少一种形状，以增加可用于对准待焊接到其上的至少一个部件的多个边缘。 垫可以例如附接到表面安装陶瓷部件，无基座部件，引线框架部件和/或板上部件上。

公开(公告)号：US09961770B2

公开(公告)日：2018-05-01

申请号：US14337377

申请日：2014-07-22

Applicant: Cree, Inc.

Inventor： Andrew K. Dummer

IPC: B23K1/00 ,  B23K1/20 ,  H05K1/18 ,  H05K3/34 ,  F21K99/00 ,  H05K1/11 ,  H05K1/02 ,  B23K31/02

CPC classification number: H05K1/111 ,  B23K1/0016 ,  B23K1/20 ,  B23K31/02 ,  H01L2224/16225 ,  H05K1/0295 ,  H05K1/181 ,  H05K3/341 ,  H05K3/3436 ,  H05K2201/09381 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2203/04 ,  H05K2203/048 ,  Y02P70/611

Abstract: Solder pads, systems, and related methods are provided. A first or second pad include at least one shape for increasing a number of edges available to align at least one part to be soldered thereto. Each solder pad can occupy a same surface area of the substrate. A plurality of circuit elements can be provided over the plurality of solder pads, where some of the circuit elements occupy different surface areas of the substrate and/or the solder pad. A method of providing a solder pad includes providing a substrate, providing a solder pad over the substrate, and providing at least one shape in the solder pad for increasing a number of edges available to align at least one part to be soldered thereto. The pads can attach for example to a surface-mount ceramic component, a submount-free component, a leadframe component and/or a chip on board component.