公开(公告)号：US20240268020A1

公开(公告)日：2024-08-08

申请号：US18630293

申请日：2024-04-09

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Kyouhei SAWAKI ,  Yuki UEDA ,  Shingo OKUNO ,  Mayuko TATEMICHI

IPC: H05K1/03 ,  H01B1/02 ,  H01B3/44 ,  H05K1/09

CPC classification number: H05K1/0373 ,  H01B1/02 ,  H01B3/445 ,  H05K1/09

Abstract: The disclosure aims to provide a composition having excellent UV laser processibility and good electric properties, a circuit board, and a method for producing a composition. The composition contains a perfluorinated fluororesin and zinc oxide.

公开(公告)号：US20240093052A1

公开(公告)日：2024-03-21

申请号：US18517445

申请日：2023-11-22

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Yuki UEDA ,  Shingo Okuno ,  Akiyoshi Yamauchi ,  Yoshihiro Souda ,  Yasukazu Nakatani

IPC: C09D127/18 ,  H05K1/05

CPC classification number: C09D127/18 ,  H05K1/056

Abstract: Provided is an aqueous coating composition capable of forming a fluororesin coating film layer with excellent electrical properties and surface physical properties, and good adhesive properties. A coating composition containing 2 or more kinds of fluororesins, wherein at least 1 kind of the fluororesin, a fluororesin (I), has a number of functional groups of 30 to 1,000 per 106 main-chain carbon atoms, and the coating composition further contains an inorganic filler, a surfactant, a liquid medium, and a non-fluororesin.

公开(公告)号：US20240084158A1

公开(公告)日：2024-03-14

申请号：US18513786

申请日：2023-11-20

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Yuki UEDA ,  Shingo OKUNO ,  Akiyoshi YAMAUCHI ,  Yoshihiro SOUDA ,  Yasukazu NAKATANI

IPC: C09D127/18 ,  H05K1/05

CPC classification number: C09D127/18 ,  H05K1/056

Abstract: Provided is an aqueous coating composition capable of forming a fluororesin coating film layer with excellent electrical properties and surface physical properties, and good adhesive properties. A coating composition containing 2 or more kinds of fluororesins, where at least 1 kind of the fluororesin, a fluororesin (I), has a number of functional groups of 30 to 1,000 per 106 main-chain carbon atoms, and where the coating composition further contains an inorganic filler, a surfactant, and a liquid medium.

公开(公告)号：US20230287236A1

公开(公告)日：2023-09-14

申请号：US18309940

申请日：2023-05-01

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Yuki UEDA ,  Shingo Okuno ,  Hirokazu Komori ,  Yasukazu Nakatani ,  Akiyoshi Yamauchi

IPC: C09D127/18 ,  C09D7/65 ,  C09D7/20 ,  C09D7/61 ,  C09D127/14 ,  C09D5/16

CPC classification number: C09D127/18 ,  C09D7/65 ,  C09D7/20 ,  C09D7/61 ,  C09D127/14 ,  C09D5/16

Abstract: An aqueous coating material composition containing fluororesin particles (A) that can be melt-molded, further containing a binder resin (B), a non-fluorinated surfactant (C) and water (D). The binder resin (B) has a weight loss of 55% or more at 400° C. measured under conditions at 10° C./min under N2, and is contained at a ratio of 10 mass % or less relative to the total solid content of the coating material composition. Also disclosed is a coated article having a coating layer formed by application of the aqueous coating material composition

公开(公告)号：US20230265309A1

公开(公告)日：2023-08-24

申请号：US18311305

申请日：2023-05-03

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Yuki UEDA ,  Shingo OKUNO ,  Hirokazu KOMORI ,  Yasukazu NAKATANI ,  Akiyoshi YAMAUCHI

IPC: C09D127/12 ,  C09D7/47 ,  C09D7/61 ,  H05K1/03

CPC classification number: C09D127/12 ,  C09D7/47 ,  C09D7/61 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/015

Abstract: An aqueous coating material composition containing fluororesin particles (A) that can be melt-molded, further comprising silica particles (B), a non-fluorinated surfactant (C) and water (D), wherein the fluororesin particles (A) have an average particle size of 0.05 to 1000 μm, wherein the silica particles (B) have an average particle size of 0.1 to 20 μm, wherein the fluororesin particles (A) and the silica particles (B) have a blending ratio: Fluororesin particles (A)/Silica particles (B)=10/90 to 90/10 (mass ratio), and wherein a content of fluororesin particles (A) is 15 to 80 mass % relative to 100 mass % of solid content of the coating material. Also disclosed is a coated article including a coating layer formed by applying the aqueous coating material composition.

公开(公告)号：US20170204233A1

公开(公告)日：2017-07-20

申请号：US15326896

申请日：2015-07-16

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Koji NAKANISHI ,  Yuki UEDA ,  Haruhisa MASUDA ,  Kazuki SAKAMI

IPC: C08J5/18 ,  G10K13/00 ,  C08L71/00

CPC classification number: C08J5/18 ,  C08G2650/40 ,  C08J2371/10 ,  C08J2427/18 ,  C08L27/18 ,  C08L71/00 ,  C08L71/10 ,  G10K13/00 ,  H04R7/02

Abstract: The present invention aims to provide a film having excellent mechanical strength and abrasion resistance. The film of the present invention contains an aromatic polyether ketone resin (I) and a fluororesin (II). The aromatic polyether ketone resin (I) has a crystallinity of 10% or higher.

公开(公告)号：US20160163413A1

公开(公告)日：2016-06-09

申请号：US14906939

申请日：2014-07-24

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Yuki UEDA ,  Masami NISHIUMI ,  Haruhisa MASUDA

IPC: H01B3/30 ,  C08L71/00 ,  H01B3/44 ,  C08L27/18

CPC classification number: H01B3/30 ,  C08G2650/40 ,  C08L27/18 ,  C08L71/00 ,  C08L2203/202 ,  C09D127/18 ,  C09D171/00 ,  H01B3/307 ,  H01B3/427 ,  H01B3/442 ,  H01B3/445 ,  C08L71/12

Abstract: The present invention aims to provide a resin composition which can provide a molded article excellent in insulation and showing a low relative permittivity and which causes no melt fracture even when extrusion-molded at a high shear rate. The resin composition of the present invention includes an aromatic polyether ketone resin (I) and a fluororesin (II). The fluororesin (II) is a copolymer of tetrafluoroethylene and a perfluoro ethylenically unsaturated compound represented by the following formula (1): CF2═CF-Rf1   (1) wherein Rf1 represents —CF3 or —ORf2; and Rf2 represents a C1-C5 perfluoroalkyl group. The aromatic polyether ketone resin (I) and the fluororesin (II) satisfy a melt viscosity ratio (I)/(II) of not lower than 0.001 but lower than 0.3.

Abstract translation: 本发明的目的在于提供一种能够提供绝缘性优异且相对介电常数低的成型体的树脂组合物，即使在高剪切速度下进行挤出成型也不会发生熔融断裂。 本发明的树脂组合物包括芳族聚醚酮树脂（I）和氟树脂（II）。 氟树脂（II）是由下式（1）表示的四氟乙烯与全氟烯属不饱和化合物的共聚物：CF2 = CF-Rf1（1）其中Rf1表示-CF3或-ORf2; Rf2表示C1-C5全氟烷基。 芳族聚醚酮树脂（I）和氟树脂（II）的熔融粘度比（I）/（II）满足不低于0.001但低于0.3。

公开(公告)号：US20220332025A1

公开(公告)日：2022-10-20

申请号：US17847859

申请日：2022-06-23

Applicant: DAIKIN INDUSTRIES, LTD. ,  TSINGHUA UNIVERSITY

Inventor： Xuming XIE ,  Yuki UEDA ,  Masaji KOMORI ,  Akiyoshi YAMAUCHI

IPC: B29C45/00 ,  C08L27/12

Abstract: A composition containing a melt-moldable fluororesin having a 1% decomposition temperature of 300° C. or higher and a thermotropic liquid crystal polymer, 90 mol % or more of all repeating units of the thermotropic liquid crystal polymer having an aromatic structure. The fluororesin is contained in an amount of 99.99 to 97% by mass and the thermotropic liquid crystal polymer is contained in an amount of 0.01 to 3% by mass relative to the composition. Also disclosed is an injection-molded article and a molding aid for injection molding fluororesin.

公开(公告)号：US20250034425A1

公开(公告)日：2025-01-30

申请号：US18910540

申请日：2024-10-09

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Yuki UEDA ,  Ai YAMASHITA ,  Shingo OKUNO ,  Akiyoshi YAMAUCHI

IPC: C09D127/18 ,  C08J7/04 ,  C08K3/34 ,  C08K3/38 ,  C09D7/61

Abstract: Provided is a coating composition capable of forming a coating film layer, which has low coefficient of linear expansion at low dielectricity, excellent adhesive properties even when the surface of a counterpart material is smooth, and few coating film defects such as cracks and holes. A coating composition including 2 or more kinds of fluororesin emulsions, wherein at least 1 kind of the fluororesin, a fluororesin (I), has a number of functional groups of 30 to 1,000 per 106 main-chain carbon atoms, and the coating composition further includes an anisotropic filler, a surfactant, and a liquid medium.

公开(公告)号：US20240262984A1

公开(公告)日：2024-08-08

申请号：US18627638

申请日：2024-04-05

Applicant: DAIKIN INDUSTRIES, LTD.

Inventor： Kyouhei SAWAKI ,  Yuki UEDA ,  Shingo OKUNO ,  Mayuko TATEMICHI

IPC: C08K5/3492 ,  C08J3/20 ,  C08K3/36 ,  C08K5/3475 ,  H05K1/03

CPC classification number: C08K5/3492 ,  C08J3/201 ,  C08K3/36 ,  C08K5/3475 ,  H05K1/0346 ,  C08J2327/18

Abstract: The disclosure aims to provide a composition having excellent UV laser processibility, a circuit board, and a method for producing a composition. The composition contains a fluororesin and a nitrogen-containing heterocyclic compound having a 18 by mass reduction temperature during pyrolysis of 330° C. or higher, and has an absorbance of light with a wavelength of 355 nm of 0.6 or higher.