公开(公告)号：US20220088740A1

公开(公告)日：2022-03-24

申请号：US17413939

申请日：2019-12-13

Applicant: DALIAN UNIVERSITY OF TECHNOLOGY

Inventor： Zhigang DONG ,  Kang SHI ,  Renke KANG ,  Liwei OU ,  Xianglong ZHU ,  Shang GAO

IPC: B24B7/22 ,  B24B37/04 ,  B24B37/10 ,  H01L21/306 ,  C09G1/02 ,  C09K3/14

Abstract: A semiconductor wafer is adhered and fixed to a polishing head by means of a conductive adhesive, and the wafer is connected to a positive electrode of an external power supply through wires of the inner and outer rings of a conductive slip ring below the wafer. A polishing pad is adhered to the bottom of a counter electrode disc, the counter electrode disc is fixed at the bottom of a polishing disc and is processed with through holes at the position corresponding to the polishing disc, and the counter electrode disc is connected to a negative electrode of the external power supply through the wires of inner and outer rings of a conductive slip ring above the counter electrode disc. Ultraviolet light emitted by an ultraviolet light source can reach the surface of the wafer through the through holes, and a polishing solution can be sprayed through the through holes into a contact area between the wafer and the polishing pad.