ULTRASONIC CUTTING METHOD EMPLOYING STRAIGHT-BLADE SHARP KNIFE AND APPLICATION THEREOF

    公开(公告)号:US20210031393A1

    公开(公告)日:2021-02-04

    申请号:US16968124

    申请日:2019-02-02

    Abstract: Disclosed is an ultrasonic cutting method employing a straight-blade sharp knife. The ultrasonic cutting method employing the straight-blade sharp knife includes the following steps: S1, measuring parameters of the straight-blade sharp knife; S2, initially rotating, by the straight-blade sharp knife, around an axis thereof, such that a rear knife surface of the straight-blade sharp knife is attached to or is away from a machined surface, and performing ultrasonic vibration cutting on a material according to a machining track; S3, performing quality detection on the machined material surface obtained by the ultrasonic vibration cutting, completing the machining if the surface passes the detection, and performing step S4 if the surface does not pass the detection; S4, further increasing an amount of rotation of the straight-blade sharp knife during initial rotation around the axis thereof, performing the ultrasonic vibration cutting on the material according to the machining track, and performing step S3.

    Helical Milling Tool with Forward-Backward Feeding

    公开(公告)号:US20210362248A1

    公开(公告)日:2021-11-25

    申请号:US17053044

    申请日:2018-05-04

    Abstract: Disclosed is a helical milling tool with forward-backward feeding, the tool including a cutting portion, a neck portion and a handle portion, which are successively connected to each other; wherein the cutting portion includes a front-end cutting section, a circumferential cutting section and a back-end cutting section, which are connected successively to each other; the front-end cutting section is of an end milling cutter structure or a drill bit structure; the circumferential cutting section is of a cylindrical shape and is of a circumferential milling cutter structure; and the back-end cutting section is of a frustum-shaped. The tool can avoid defects such as layering and tearing, which go beyond processing requirements in a composite material, improve the processing quality, save on costs, simplify the processing process, improve the production efficiency and prolong the service life of the tool.

    COMBINED GRINDING WHEEL FOR ULTRASONIC MACHINING AND DESIGN METHOD THEREFOR

    公开(公告)号:US20220324076A1

    公开(公告)日:2022-10-13

    申请号:US17597678

    申请日:2019-08-29

    Abstract: A combined grinding wheel for ultrasonic machining and the determine method thereof. The combined grinding wheel for ultrasonic machining comprises: an outer grinding ring, an upper end thereof having a center taper hole and a plurality of outer grinding ring water holes located in a circumferential outer side of the center taper hole; a connecting taper shank, the upper end thereof having a taper shank extending into an outer grinding ring cavity from the center taper hole and matching the tapered surface of the center taper hole; a connecting flange, located outside the shank portion and fixed on the inner wall of the upper end of the outer grinding ring cavity, and having a center tapered through hole; and an inner vibration unit, having a tapered surface matching the tapered surface of the center tapered through hole and a center hole connected with the connecting taper shank by means of a screw.

    SEMICONDUCTOR WAFER PHOTOELECTROCHEMICAL MECHANICAL POLISHING PROCESSING DEVICE AND PROCESSING METHOD

    公开(公告)号:US20220088740A1

    公开(公告)日:2022-03-24

    申请号:US17413939

    申请日:2019-12-13

    Abstract: A semiconductor wafer is adhered and fixed to a polishing head by means of a conductive adhesive, and the wafer is connected to a positive electrode of an external power supply through wires of the inner and outer rings of a conductive slip ring below the wafer. A polishing pad is adhered to the bottom of a counter electrode disc, the counter electrode disc is fixed at the bottom of a polishing disc and is processed with through holes at the position corresponding to the polishing disc, and the counter electrode disc is connected to a negative electrode of the external power supply through the wires of inner and outer rings of a conductive slip ring above the counter electrode disc. Ultraviolet light emitted by an ultraviolet light source can reach the surface of the wafer through the through holes, and a polishing solution can be sprayed through the through holes into a contact area between the wafer and the polishing pad.

    Ultrasonic Cutting Holder For Honeycomb Core

    公开(公告)号:US20210268679A1

    公开(公告)日:2021-09-02

    申请号:US16968122

    申请日:2019-02-02

    Abstract: The present disclosure discloses an ultrasonic cutting holder for a honeycomb core, including a holder, a swing mechanism, a transducer, a first-stage amplitude transformer, a second-stage amplitude transformer, an ultrasonic cutting tool, and an ultrasonic power transmission mechanism. The present disclosure provides an ultrasonic cutting holder for a honeycomb core with large amplitude output capacity and considering the interchangeability requirements among different vibration systems, which solves the problem of the applicability of ultrasonic cutting holder on the universal machine tool and improves the automation level of ultrasonic cutting.

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