公开(公告)号：US20180164409A1

公开(公告)日：2018-06-14

申请号：US15882074

申请日：2018-01-29

Applicant: DAPA INC.

Inventor： TING-YI CHEN

IPC: G01S7/481 ,  G01J1/42 ,  G01S17/08 ,  G01J1/02 ,  H01L25/16 ,  H01L31/167 ,  H01L31/02

CPC classification number: G01S7/4813 ,  G01J1/02 ,  G01J1/0271 ,  G01J1/42 ,  G01J1/4204 ,  G01S7/4814 ,  G01S7/4816 ,  G01S17/023 ,  G01S17/026 ,  G01S17/08 ,  H01L24/48 ,  H01L25/16 ,  H01L25/165 ,  H01L25/167 ,  H01L31/02005 ,  H01L31/02019 ,  H01L31/0203 ,  H01L31/02325 ,  H01L31/167 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/1433

Abstract: A complex optical proximity sensor includes a substrate, a light emitter coupled to the substrate, an application-specific integrated circuit chip coupled to the substrate and embedded in a proximity sensor, a barrier disposed between the application-specific integrated circuit chip and the light emitter, and an ambient light detection chip manufactured in advance and then coupled to the application-specific integrated circuit chip thereon with a pre-determined height. The elements are disposed within a limited area of an aperture and, with a manufacturing method of the complex optical proximity sensor, the detection angle of the ambient light is thereby maximized and the detection angle of the proximity sensor is thereby minimized.

公开(公告)号：US20180292568A1

公开(公告)日：2018-10-11

申请号：US15616145

申请日：2017-06-07

Applicant: DAPA, INC.

Inventor： TING-YI CHEN

IPC: G01V8/14 ,  G01S17/02 ,  G01S7/497 ,  G01S7/02 ,  G01S7/481 ,  G01S7/486

Abstract: A complex optical proximity sensor has a vertical-cavity surface emitting laser (VCSEL), an ambient lights detection chip, and a proximity sensor (PS) arranged in linear alignment to form a self-integrated barrier within the structure. The PS only receives lights with a first wavelength and a first energy and the ambient lights detection chip solely receives lights with a second wavelength and a second energy to prevent the VCSEL from interfering with the PS. Meanwhile, the arrangement has the ambient lights detection chip disposed in a middle section of an oblong opening to maximize a detection angle of ambient lights.

公开(公告)号：US20180054164A1

公开(公告)日：2018-02-22

申请号：US15281893

申请日：2016-09-30

Applicant: DAPA INC.

Inventor： TING-YI CHEN

IPC: H03B5/32 ,  H05K1/03 ,  H05K1/02 ,  H04R3/00 ,  H04M1/02

CPC classification number: H03B5/32 ,  H03B2200/002 ,  H03H7/00 ,  H03H9/0519 ,  H03H9/0547 ,  H03H9/0561 ,  H03H9/205 ,  H04M1/026 ,  H04M1/0277 ,  H04R3/00 ,  H05K1/0237 ,  H05K1/0306 ,  H05K2201/10083

Abstract: A structure of an integrated crystal oscillator package has a first quartz crystal resonator, a second quartz crystal resonator, and application-specific integrated circuit chip (ASIC) combined in a package. The ASIC has a switch control for receiving audio formats of 44.1 kHz and 48 kHz with different hi-fidelity (hi-fi). The first quartz crystal resonator has a first clock rate corresponding to the 44.1 kHz frequency and the second quartz crystal resonator has a second clock rate corresponding to the 48 kHz frequency to be switched by the present invention in operation.