公开(公告)号：US09607933B2

公开(公告)日：2017-03-28

申请号：US14176022

申请日：2014-02-07

Applicant: DAWNING LEADING TECHNOLOGY INC

Inventor： Diann Fang Lin

IPC: H01L23/495 ,  H01L23/31 ,  H01L21/48

CPC classification number: H01L23/49541 ,  H01L21/4828 ,  H01L21/4842 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49582 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/181 ,  Y10T29/49204 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A lead frame structure for quad flat no-lead (QFN) package includes a main base, a plurality of terminals and a first metal layer. The main base has a center area for carrying a semiconductor die, and a periphery area surrounding the center area. The plurality of terminals are arranged around the main base. The first metal layer has a first part formed on the periphery area of the main base, and a second part formed on the plurality of terminals. Wherein the main base and the plurality of terminals are formed by a stamping process, and the first metal layer is formed by a plating process before the stamping process.

公开(公告)号：US09161446B2

公开(公告)日：2015-10-13

申请号：US14160452

申请日：2014-01-21

Applicant: DAWNING LEADING TECHNOLOGY INC.

Inventor： Diann Fang Lin

IPC: H05K1/11 ,  H05K1/16 ,  H05K3/34

CPC classification number: H05K1/115 ,  H01H2207/04 ,  H01H2227/018 ,  H05K1/16 ,  H05K3/3436 ,  H05K2201/09472 ,  H05K2201/09563 ,  H05K2201/10053 ,  H05K2201/10265 ,  H05K2201/1031 ,  Y02P70/611

Abstract: A micro electronic component structure includes an insulating body, at least one conductive through hole, at least one conductive material, and at least one micro terminal. The insulating body has a top surface and a bottom surface. The conductive through hole penetrates the top surface and the bottom surface. The conductive material is formed in the conductive through hole. The micro terminal is disposed above the conductive material.

Abstract translation: 微电子部件结构包括绝缘体，至少一个导电通孔，至少一个导电材料和至少一个微型端子。 绝缘体具有顶表面和底表面。 导电通孔穿透顶面和底面。 导电材料形成在导电通孔中。 微型端子设置在导电材料之上。