公开(公告)号：US20030175421A1

公开(公告)日：2003-09-18

申请号：US10248061

申请日：2002-12-13

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Kurt F. O'Connor ,  Larry William Houk ,  Derek S. Ferraro ,  Mary A. Beam ,  Larry G. Hyman ,  Henry M. Sanftleben ,  B. Samuel Platt

IPC: B05D003/08

CPC classification number: B08B7/0071 ,  B22D17/2007 ,  B22D29/003 ,  B22D31/002

Abstract: A process of cleaning a component following a forming operation that has left a residue on the component surface. The process comprises a thermal treatment during which the surface of the component is subjected to a controlled open flame, preferably in the presence of a limited amount of excess oxygen. Residues can be removed by the open flame to the extent that adhesion of a coating to the component surface can be greatly enhanced. Surface residue levels prior to the thermal treatment can be reduced by the use of lubricants prepared by diluting with de-ionized water or reverse osmosis water, thereby further increasing the likelihood of a residue-free surface having optimal adhesion properties. Under some circumstances, residue levels can be sufficiently reduced with the use of lubricants diluted with de-ionized or reverse osmosis water such that the thermal treatment can be omitted.

Abstract translation: 在成分操作之后清洁组分表面上留下残留物的方法。 该方法包括热处理，其中组分的表面经受受控的明火，优选在有限量的过量氧的存在下进行。 可以通过明火去除残留物，使得涂层对组分表面的粘附可以大大增强。 通过使用通过用去离子水或反渗透水稀释制备的润滑剂，可以减少热处理前的表面残留量，从而进一步增加无残留表面具有最佳粘合性能的可能性。 在某些情况下，使用用去离子水或反渗透水稀释的润滑剂可以充分降低残留物含量，从而可以省略热处理。