公开(公告)号：US20220010116A1

公开(公告)日：2022-01-13

申请号：US17293879

申请日：2019-11-14

Applicant: DENKA COMPANY LIMITED

Inventor： Tometomo UCHIDA ,  Takashi DOMOTO ,  Takako TANIGAWA ,  Kenji NOMURA ,  Yoshitsugu GOTO

IPC: C08L23/22 ,  C08L33/02 ,  C08K5/5397 ,  C08K5/3417 ,  C09J133/02 ,  C09J7/10

Abstract: A composition for temporary bonding, including the following (A) to (C). An adhesive for temporary bonding for manufacturing an electronic device, including the composition for temporary bonding. (A) A (meth)acrylate comprising the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer; and (C) a photo radical polymerization initiator.