公开(公告)号：US20230193090A1

公开(公告)日：2023-06-22

申请号：US17923377

申请日：2021-05-17

Applicant: DENKA COMPANY LIMITED

Inventor： Tometomo UCHIDA ,  Toru ARAI ,  Takashi DOMOTO ,  Takako TANIGAWA ,  Jun WATANABE ,  Megumi SUDO ,  Jun YOSHIDA

IPC: C09J123/22 ,  C08K5/00 ,  C08F2/44 ,  C08F2/48 ,  H01L21/02 ,  C08K5/101 ,  C08F20/20 ,  C09J11/06

CPC classification number: C09J123/22 ,  C08K5/0025 ,  C08F2/44 ,  C08F2/48 ,  H01L21/02304 ,  H01L21/0231 ,  C08K5/101 ,  C08F20/20 ,  C09J11/06

Abstract: A composition for temporary bonding, includes: (A) a (meth)acrylate having the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose side chain is an alkyl group having 18 or more carbon atoms and homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer and/or a polyisobutene copolymer; and (C) a photo radical polymerization initiator.

公开(公告)号：US20220010116A1

公开(公告)日：2022-01-13

申请号：US17293879

申请日：2019-11-14

Applicant: DENKA COMPANY LIMITED

Inventor： Tometomo UCHIDA ,  Takashi DOMOTO ,  Takako TANIGAWA ,  Kenji NOMURA ,  Yoshitsugu GOTO

IPC: C08L23/22 ,  C08L33/02 ,  C08K5/5397 ,  C08K5/3417 ,  C09J133/02 ,  C09J7/10

Abstract: A composition for temporary bonding, including the following (A) to (C). An adhesive for temporary bonding for manufacturing an electronic device, including the composition for temporary bonding. (A) A (meth)acrylate comprising the following (A-1) and (A-2): (A-1) a monofunctional (meth)acrylate whose homopolymer has a Tg of −100° C. to 60° C., and (A-2) a polyfunctional (meth)acrylate; (B) a polyisobutene homopolymer; and (C) a photo radical polymerization initiator.