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1.发明公开公开(公告)号：US20240254313A1
公开(公告)日：2024-08-01
申请号：US18560463
申请日：2022-05-06
Applicant: DENKA COMPANY LIMITED
Inventor： Teruhiro AIKYO , Takaaki MINAMIKAWA , Yasuaki HATAYAMA , Naoto HAYASHI
CPC classification number: C08K3/36 , C01B33/12 , H01L23/295 , C01P2006/12 , C08K2201/005 , C08K2201/006
Abstract: Provided are a silica powder with a particle size of 2.0 μm or less which does not readily aggregate, has favorable handling, and readily disperses when mixed with a resin; and a resin composition and a semiconductor sealing material comprising the silica powder.
The silica powder has a volume-based cumulative size (D50) of 2.0 μm or less and a maximum particle size (Dmax) of 5.0 μm or less as measured by a grind gauge with the following method.
(Measurement Method)
The degree of dispersion of the silica powder in the epoxy resin is evaluated in a resin composition obtained by adding 67 parts by mass of the silica powder to 100 parts by mass of a bisphenol F-type liquid epoxy resin with a distribution map method using a grind gauge and the maximum particle size (Dmax) is measured in accordance with JIS K 5600-2-5. Further, the same evaluation is performed five times and the average value thereof is employed.-
公开(公告)号：US20250136454A1
公开(公告)日：2025-05-01
申请号：US18837178
申请日：2023-02-06
Applicant: Denka Company Limited
Inventor： Takaaki MINAMIKAWA , Hiroyuki SHIOTSUKI , Genta KARINO
Abstract: This spherical silica powder is configured such that when the spherical silica powder is measured using a wet flow type image analyzer, a sphericity of a particle size of more than or equal to 5 μm and less than 10 μm is represented by S1, a sphericity of a particle size of more than or equal to 10 μm and less than 20 μm is represented by S2, a sphericity of a particle size of more than or equal to 20 μm and less than 30 μm is represented by S3, a sphericity of a particle size of more than or equal to 30 μm and less than 45 μm is represented by S4, and a sphericity of a particle size of more than or equal to 45 μm is represented by S5, at least two of S1, S2, S3, S4, and S5 are more than or equal to 0.74.
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公开(公告)号：US20240182318A1
公开(公告)日：2024-06-06
申请号：US18282440
申请日：2022-03-22
Applicant: DENKA COMPANY LIMITED
Inventor： Takaaki MINAMIKAWA , Hiroyuki SHIOTSUKI , Koji MIYAZAKI
CPC classification number: C01F7/46 , C01B33/181 , C01P2004/32 , C01P2004/61 , C01P2006/12
Abstract: A metal oxide powder in which the metal is other than uranium, iron and titanium, and, in the metal oxide powder, the content rate of uranium is 1.0 ppb by mass or less, the content rate of iron is 100 ppm by mass or less in terms of Fe2O3, the content rate of titanium in terms of TiO2 oxide is 8 ppm by mass or less. Included is a method of producing a metal oxide powder which removes impurities from a metal oxide powder so that a metal oxide powder having a high purity can be obtained, and a metal oxide powder produced according to the method.
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Patent Agency Ranking
公开(公告)号：US20250033982A1
公开(公告)日：2025-01-30
申请号：US18836730
申请日：2023-02-06
Applicant: Denka Company Limited
Inventor： Takaaki MINAMIKAWA , Hiroyuki SHIOTSUKI , Genta KARINO
IPC: C01B33/18
Abstract: In spherical silica powder according to an embodiment of the present invention, an NO3− content obtained based on an ion chromatography method is less than or equal to 5 ppm.
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公开(公告)号：US20240158609A1
公开(公告)日：2024-05-16
申请号：US18284804
申请日：2022-03-24
Applicant: DENKA COMPANY LIMITED
Inventor： Takaaki MINAMIKAWA , Akihiko YAMAMOTO , Takashi FUKUDA
CPC classification number: C08K3/36 , C01B33/12 , C08K2201/003 , C08K2201/006
Abstract: An inorganic powder having a volume-based cumulative 50% diameter D50 of 1.2-2.8 μm, having a volume-based particle size frequency distribution that includes at least a first peak and a second peak located on a larger-particle-diameter side of the first peak, wherein the first peak has a half-width smaller than 0.5 μm.
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公开(公告)号：US20240174520A1
公开(公告)日：2024-05-30
申请号：US18284796
申请日：2022-03-24
Applicant: DENKA COMPANY LIMITED
Inventor： Takaaki MINAMIKAWA , Akihiko YAMAMOTO , Takashi FUKUDA
CPC classification number: C01B33/18 , C08K3/36 , H01L23/295 , C01P2004/32 , C01P2004/51 , C01P2004/62 , C01P2006/80 , H01L21/565
Abstract: A spherical inorganic powder having, in a particle size frequency distribution, a first peak having a local maximum value in a particle size region from 0.1 μm or larger to 0.6 μm or smaller, and a second peak having a local maximum value in a particle size region from 1.5 μm or larger to 5.0 μm or smaller, wherein a value of a ratio of a frequency at the local maximum value of the second peak to a frequency at the local maximum value of the first peak is 1.5 or higher and lower than 10.0.
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公开(公告)号：US20240158242A1
公开(公告)日：2024-05-16
申请号：US18282319
申请日：2022-03-22
Applicant: DENKA COMPANY LIMITED
Inventor： Takaaki MINAMIKAWA , Hiroyuki SHIOTSUKI , Koji MIYAZAKI
IPC: C01B33/18
CPC classification number: C01B33/18 , C01P2004/51 , C01P2006/12 , C01P2006/20 , C01P2006/90
Abstract: A silicon dioxide powder has a uranium content of 0.8 ppb by mass or less and a sphericity of 0.80 or more. The silicon dioxide powder has a low uranium content and a high sphericity.
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公开(公告)号：US20240150184A1
公开(公告)日：2024-05-09
申请号：US18282347
申请日：2022-03-11
Applicant: DENKA COMPANY LIMITED
Inventor： Hiroyuki SHIOTSUKI , Takaaki MINAMIKAWA , Koji MIYAZAKI
IPC: C01B33/18
CPC classification number: C01B33/18 , C01P2004/61 , C01P2006/12 , C01P2006/40 , C01P2006/80
Abstract: Silica powder having a dielectric loss tangent of 0.004 or less, in which the number of silicon metal particles in 10 g of the silica powder is 30 or less. A method for producing silica powder, including a heating step of heating silica powder in the presence of chlorine. Silica powder having a low dielectric loss tangent and a low silicon metal content, and a method for producing the silica powder can be provided.
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