公开(公告)号：US20170245373A1

公开(公告)日：2017-08-24

申请号：US15434466

申请日：2017-02-16

Applicant: DENSO CORPORATION

Inventor： Akito IWAMA ,  Shinichi AWANO ,  Seiji TACHIBANA

IPC: H05K3/22 ,  B05D5/00 ,  H05K1/02

CPC classification number: H05K3/22 ,  B05D1/26 ,  B05D5/00 ,  H05K1/0203 ,  H05K1/0209 ,  H05K3/284 ,  H05K2201/0209 ,  H05K2201/06 ,  H05K2201/10166 ,  H05K2203/0126

Abstract: There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.