公开(公告)号：US20140084744A1

公开(公告)日：2014-03-27

申请号：US14028919

申请日：2013-09-17

Applicant: DENSO CORPORATION

Inventor： Junichi NAKAZONO ,  Kiyokazu FUTAMI ,  Seiji TACHIBANA

IPC: H02K1/28

CPC classification number: H02K1/28 ,  H02K1/2766

Abstract: In a rotary electric machine having a rotor core of a skew structure, when one of the core blocks is sequentially stacked on the other of the core blocks to form a step skew, a communication reference groove is formed along an axial direction of the rotor core by aligning a side section of a short protruding section in one core block with a side section of the long protruding sections in the other core block, and by aligning a side section of a long protruding section in one core block with a side section of a short protruding section in the other core block. The core blocks are correctly stacked by aligning the side section of the long protruding sections with the side section of the short protruding sections.

Abstract translation: 在具有歪斜结构的转子铁心的旋转电机中，当芯块中的一个顺序地堆叠在另一个芯块上以形成歪斜时，沿着转子芯的轴向形成连通基准槽 通过将一个芯块中的短突出部分的侧部与另一个芯块中的长突出部分的侧部对齐，并且将一个芯块中的长突出部分的侧部与其中的一个部分 另一个芯块中的短突出部分。 通过将长突出部分的侧部与短突出部分的侧部对准，芯块被正确堆叠。

公开(公告)号：US20170245373A1

公开(公告)日：2017-08-24

申请号：US15434466

申请日：2017-02-16

Applicant: DENSO CORPORATION

Inventor： Akito IWAMA ,  Shinichi AWANO ,  Seiji TACHIBANA

IPC: H05K3/22 ,  B05D5/00 ,  H05K1/02

CPC classification number: H05K3/22 ,  B05D1/26 ,  B05D5/00 ,  H05K1/0203 ,  H05K1/0209 ,  H05K3/284 ,  H05K2201/0209 ,  H05K2201/06 ,  H05K2201/10166 ,  H05K2203/0126

Abstract: There is provided a method of manufacturing an electronic unit that includes an electronic component having a rectangular plate shape and generating heat during operation, and a heat dissipation gel covering the electronic component. The method includes a side surface coating step of coating opposite two side surfaces of four side surfaces of the electronic component with the heat dissipation gel by discharging the heat dissipation gel from a flat-shaped opening of a nozzle, and a top surface coating step of coating a top surface of the electronic component by discharging the heat dissipation gel from the opening of the nozzle after completion of the side surface coating step.