公开(公告)号：US20230016437A1

公开(公告)日：2023-01-19

申请号：US17861316

申请日：2022-07-11

Applicant: DENSO CORPORATION

Inventor： Yasushi FURUKAWA ,  Hirohito FUJITA ,  Tetsuto YAMAGISHI ,  Atsuya AKIBA

IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31

Abstract: In a semiconductor device, a first wiring member is electrically connected to a first main electrode on a first surface of a semiconductor element, and a second wiring member is electrically connected to a second main electrode on a second surface of the semiconductor element. An encapsulating body encapsulates at least a part of each of the first and second wiring members, the semiconductor element and a bonding wire. The semiconductor element has a protective film on the first surface of the semiconductor substrate, and the pad has an exposed surface exposed from an opening of the protective film. The exposed surface includes a connection area to which the bonding wire is connected, and a peripheral area on a periphery of the connection area. The peripheral area has a surface that defines an angle of 90 degrees or less relative to a surface of the connection area.

公开(公告)号：US20190221490A1

公开(公告)日：2019-07-18

申请号：US16080756

申请日：2017-04-12

Applicant: DENSO CORPORATION

Inventor： Hirohito FUJITA

IPC: H01L23/31 ,  H01L23/498 ,  H05K7/02 ,  H01L23/00 ,  H01L23/367

Abstract: An electronic device includes an electronic component (12), a sealing resin body (11) sealing the electronic component, and a plurality of conductive members electrically connected to the electronic component in the sealing resin body, including respective portions exposed from the sealing resin body to the outside of the sealing resin body, and having different potentials. The conductive members include an external connection terminal (14, 22, 23, 24, 25) extending from the inside of the sealing resin body to the outside of the sealing resin body. A surface of the external connection terminal has a connected part (40a) electrically connected to the electronic component, a higher adhesion part (43) having a higher adhesion to the sealing resin body, and a lower adhesion part (44) having an adhesion to the sealing resin body which is lower than that of the higher adhesion part. Each of the higher adhesion part and the lower adhesion part is a portion of the surface of the external connection terminal which is other than the connected part and covered with the sealing resin body. The lower adhesion part is provided in at least one of a connection surface (40) including the connected part and a back surface (41) opposite to the connection surface in a thickness direction to extend from an outer peripheral end of the sealing resin body along an extending direction of the external connection terminal.