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    SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20230130647A1

    公开(公告)日：2023-04-27

    申请号：US18146582

    申请日：2022-12-27

    Applicant: DENSO CORPORATION

    Inventor： Tetsuto YAMAGISHI ,  Yoshitsugu SAKAMOTO ,  Ryoichi KAIZU ,  Yuki INABA ,  Hiroki YOSHIKAWA

    IPC: H01L23/367 ,  H01L23/00 ,  B23K35/26 ,  C22C13/02

    Abstract: A semiconductor device includes a semiconductor chip having first and second main electrodes disposed on opposite surfaces of a silicon carbide substrate, first and second heat dissipation members disposed so as to sandwich the semiconductor chip, and joining members disposed between the first main electrode and the first heat dissipation member and between the second main electrode and the second heat dissipation member. At least one of the joining members is made of a lead-free solder having an alloy composition that contains 3.2 to 3.8 mass % Ag, 0.6 to 0.8 mass % Cu, 0.01 to 0.2 mass % Ni, x mass % Sb, y mass % Bi, 0.001 to 0.3 mass % Co, 0.001 to 0.2 mass % P, and a balance of Sn, where x and y satisfy relational expressions of x+2y≤11 mass %, x+14y≤42 mass %, and x≥5.1 mass %.

    SEMICONDUCTOR DEVICE
    4.
    发明申请
    SEMICONDUCTOR DEVICE 有权

    公开(公告)号：US20230016437A1

    公开(公告)日：2023-01-19

    申请号：US17861316

    申请日：2022-07-11

    Applicant: DENSO CORPORATION

    Inventor： Yasushi FURUKAWA ,  Hirohito FUJITA ,  Tetsuto YAMAGISHI ,  Atsuya AKIBA

    IPC: H01L23/00 ,  H01L23/495 ,  H01L23/31

    Abstract: In a semiconductor device, a first wiring member is electrically connected to a first main electrode on a first surface of a semiconductor element, and a second wiring member is electrically connected to a second main electrode on a second surface of the semiconductor element. An encapsulating body encapsulates at least a part of each of the first and second wiring members, the semiconductor element and a bonding wire. The semiconductor element has a protective film on the first surface of the semiconductor substrate, and the pad has an exposed surface exposed from an opening of the protective film. The exposed surface includes a connection area to which the bonding wire is connected, and a peripheral area on a periphery of the connection area. The peripheral area has a surface that defines an angle of 90 degrees or less relative to a surface of the connection area.

    MOLD PACKAGE
    6.
    发明申请
    MOLD PACKAGE 有权
    模具包

    公开(公告)号：US20160293555A1

    公开(公告)日：2016-10-06

    申请号：US15104255

    申请日：2015-01-09

    Applicant: DENSO CORPORATION

    Inventor： Kengo OKA ,  Tetsuto YAMAGISHI

    IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498

    CPC classification number: H01L23/562 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/3185 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K2203/1316 ,  H01L2924/00014

    Abstract: A mold package being a half-mold type includes: a substrate includes a first face and a second face; an electronic component that is mounted on the first face; and a mold resin that is provided on the first face and seals the first face with the electronic component. The second face is exposed from the mold resin. The mold resin is disposed on the first face so as to seal a sealed portion and to expose a remaining part of the first face as an exposure portion. One side face is provided by an end side face. One side face is provided by a boundary side face. At least a site on a lower end of the boundary side face is provided by an inclined face. In the boundary side face, a site on an upper end side is provided by an other inclined face having a second inclination angle.

    Abstract translation: 一种半模式的模具包装包括：基底，包括第一面和第二面; 电子部件，其安装在所述第一面上; 以及模具树脂，其设置在所述第一面上并且将所述第一面与所述电子部件密封。 第二面从模塑树脂露出。 模塑树脂设置在第一面上，以密封密封部分，并将第一面的剩余部分暴露为曝光部分。 一个侧面由端侧面提供。 一个侧面由边界侧面提供。 边界面的下端的至少一个位置由倾斜面提供。 在边界侧面，上端侧的位置由具有第二倾斜角度的另一倾斜面设置。

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