公开(公告)号：US20160104653A1

公开(公告)日：2016-04-14

申请号：US14894637

申请日：2014-06-03

Applicant: DENSO CORPORATION

Inventor： Norihisa IMAIZUMI ,  Yuuki SANADA ,  Masayuki TAKENAKA ,  Shinya UCHIBORI ,  Kengo OKA ,  Tasuke FUKUDA ,  Keitarou NAKAMA

IPC: H01L23/31 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/561 ,  H01L23/49838 ,  H01L24/97 ,  H01L25/00 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.

Abstract translation: 在基材中，一个表面和另一个表面之间的至少一个侧面是与模制树脂一起切割的切割表面。 与基板一起切割的模制树脂设置有与切割表面齐平的表面。 构成与切割表面齐平的表面的模制树脂的一部分具有与切割面平齐且平行于基板的一个表面的表面接合的表面; 该部分比密封电子部件的部分薄。 因此，用与基板的一个表面平行的表面接触的切割刀片切割模制树脂。