公开(公告)号：US20150319840A1

公开(公告)日：2015-11-05

申请号：US14427458

申请日：2013-09-24

Applicant: DENSO CORPORATION

Inventor： Yuuki SANADA ,  Norihisa IMAIZUMI ,  Shinya UCHIBORI ,  Masaji IMADA ,  Toshihiro NAKAMURA ,  Eiji YABUTA ,  Masayuki TAKENAKA

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0204 ,  H01L23/13 ,  H01L23/367 ,  H01L23/3677 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/13055 ,  H01L2924/19105 ,  H05K1/0206 ,  H05K1/0209 ,  H05K1/181 ,  H05K1/182 ,  H05K7/205 ,  H05K7/20854 ,  H05K2201/09781 ,  H05K2201/10166 ,  H01L2924/00

Abstract: In an electronic device, a heat generating element is connected directly to an electrically-conductive joining material that is the start point of the heat dissipation path on the one surface of the substrate, and the other surface of the substrate is provided by an other surface side insulating layer. An electrically-conductive other surface side electrode connected to an external heat dissipation member is disposed on the surface of the other surface side insulating layer right under the heat generating element. On the other surface side of the substrate, an other surface side inner layer wire that is the end point of the heat dissipation path extends to the other surface side insulating layer and is insulated electrically from the other surface side electrode through the other surface side insulating layer.

Abstract translation: 在电子设备中，发热元件直接连接到作为基板的一个表面上的散热路径的起始点的导电接合材料，并且基板的另一个表面由另一个表面 侧绝缘层。 连接到外部散热构件的导电的另一表面侧电极设置在发热元件正下方的另一表面侧绝缘层的表面上。 在基板的另一面侧，作为散热路径的端点的另一面侧内层线延伸到另一表面侧绝缘层，并且通过另一表面侧绝缘而与另一表面侧电极电绝缘 层。

公开(公告)号：US20170290187A1

公开(公告)日：2017-10-05

申请号：US15507364

申请日：2015-09-17

Applicant: DENSO CORPORATION

Inventor： Takashi YOSHIMIZU ,  Yuuki SANADA

IPC: H05K7/14 ,  H01L23/31 ,  H01L23/053 ,  H05K1/18 ,  H05K1/02 ,  H01G2/06 ,  H01G2/10 ,  H05K1/11 ,  H01L23/367 ,  H01G2/08 ,  H01L23/498 ,  H01L23/10

CPC classification number: H05K7/1427 ,  H01G2/065 ,  H01G2/08 ,  H01G2/103 ,  H01L23/053 ,  H01L23/10 ,  H01L23/12 ,  H01L23/28 ,  H01L23/3121 ,  H01L23/3675 ,  H01L23/49827 ,  H01L23/49844 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/115 ,  H05K1/117 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/09609 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/1056 ,  H05K2201/1059 ,  H05K2203/1327 ,  H01L2924/00

Abstract: An electronic device includes a circuit board with an insulating substrate, a wiring at the substrate, an electronic component mounted at the substrate and electrically connected to the wiring, at least one through hole through the substrate from one surface to an opposite surface of the one surface of the substrate, and a conductive member arranged at a surface of the through hole and electrically connected to the wiring; and further includes: a sealing resin; and a cap including an annular connection with a part connected to the substrate and a recess recessed from the annular connection. Furthermore, in the cap, at least a part of the connection is connected to the substrate, the cap being sealed integrally with the electronic component by the sealing resin while arranging a space communicating with the through hole; and a terminal is inserted into the through hole and electrically connected to the wiring.

公开(公告)号：US20160104653A1

公开(公告)日：2016-04-14

申请号：US14894637

申请日：2014-06-03

Applicant: DENSO CORPORATION

Inventor： Norihisa IMAIZUMI ,  Yuuki SANADA ,  Masayuki TAKENAKA ,  Shinya UCHIBORI ,  Kengo OKA ,  Tasuke FUKUDA ,  Keitarou NAKAMA

IPC: H01L23/31 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/561 ,  H01L23/49838 ,  H01L24/97 ,  H01L25/00 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.

Abstract translation: 在基材中，一个表面和另一个表面之间的至少一个侧面是与模制树脂一起切割的切割表面。 与基板一起切割的模制树脂设置有与切割表面齐平的表面。 构成与切割表面齐平的表面的模制树脂的一部分具有与切割面平齐且平行于基板的一个表面的表面接合的表面; 该部分比密封电子部件的部分薄。 因此，用与基板的一个表面平行的表面接触的切割刀片切割模制树脂。