公开(公告)号：US09941182B2

公开(公告)日：2018-04-10

申请号：US14894637

申请日：2014-06-03

Applicant: DENSO CORPORATION

Inventor： Norihisa Imaizumi ,  Yuuki Sanada ,  Masayuki Takenaka ,  Shinya Uchibori ,  Kengo Oka ,  Tasuke Fukuda ,  Keitarou Nakama

IPC: H01L29/49 ,  H01L23/31 ,  H01L25/00 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/561 ,  H01L23/49838 ,  H01L24/97 ,  H01L25/00 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00

Abstract: In a substrate, at least one lateral surface between one surface and another surface is a cut surface that is cut together with mold resin. The mold resin, which is cut together with the substrate, is provided with a surface that is flush with the cut surface. A portion of the mold resin constituting the surface flush with the cut surface has a surface that is joined to the surface flush with the cut surface and parallel to the one surface of the substrate; this portion is thinner than a portion that seals electronic parts. Consequently, the mold resin is cut with a dicing blade brought into contact with a surface parallel to the one surface of the substrate.

公开(公告)号：US09646907B2

公开(公告)日：2017-05-09

申请号：US14893987

申请日：2014-05-29

Applicant: DENSO CORPORATION

Inventor： Kengo Oka ,  Yuki Sanada ,  Masayuki Takenaka ,  Shinya Uchibori ,  Tasuke Fukuda

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L21/44 ,  H01L23/31 ,  H01L21/56 ,  H01L23/498

CPC classification number: H01L23/3121 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A mold package includes a substrate having a first surface and a second surface disposed opposite to the first surface, a wiring part disposed on the first surface in protruded manner, a molding resin, and a resin film. The molding resin partially seals the first surface of the substrate and the wiring part and intersects with the wiring part. The resin film is disposed between the first surface of the substrate and the end of the molding resin, and seals the wiring part and the first surface of the substrate adjacent to the wiring part. The resin film includes a first portion disposed inside the molding resin and a second portion disposed outside the molding resin. An upper surface of the second portion is lower than an upper surface of the first portion and has less uneven portions than the upper surface of the first portion.

公开(公告)号：US09601442B2

公开(公告)日：2017-03-21

申请号：US15104255

申请日：2015-01-09

Applicant: DENSO CORPORATION

Inventor： Kengo Oka ,  Tetsuto Yamagishi

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/28 ,  H05K3/28 ,  H01L23/498 ,  H05K1/18

CPC classification number: H01L23/562 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/3185 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/181 ,  H05K3/284 ,  H05K2203/1316 ,  H01L2924/00014

Abstract: A mold package being a half-mold type includes: a substrate includes a first face and a second face; an electronic component that is mounted on the first face; and a mold resin that is provided on the first face and seals the first face with the electronic component. The second face is exposed from the mold resin. The mold resin is disposed on the first face so as to seal a sealed portion and to expose a remaining part of the first face as an exposure portion. One side face is provided by an end side face. One side face is provided by a boundary side face. At least a site on a lower end of the boundary side face is provided by an inclined face. In the boundary side face, a site on an upper end side is provided by an other inclined face having a second inclination angle.