公开(公告)号：US10651118B2

公开(公告)日：2020-05-12

申请号：US16385285

申请日：2019-04-16

Applicant: DENSO CORPORATION

Inventor： Kosuke Suzuki ,  Atsushi Kashiwazaki ,  Yuki Sanada ,  Toshihiro Nakamura ,  Shinya Uchibori

IPC: H05K1/11 ,  H05K1/18 ,  H01L23/498 ,  H05K3/28 ,  H01L23/28 ,  H01L23/31

Abstract: A solder resist is configured such that pattern covering portions of the solder resist covering straight portions of adjacent wiring patterns are separated from each other in an area outside of a resin mold part. Thus, even if the solder resist is cracked, cracks will not be formed so as to connect between the adjacent wiring patterns. As such, even if moisture generated by condensation or the like enters in the crack, it is less likely that a short circuit will occur between the adjacent wiring patterns.