公开(公告)号：US20140217620A1

公开(公告)日：2014-08-07

申请号：US14248406

申请日：2014-04-09

Applicant: DENSO CORPORATION

Inventor： Tetsuto YAMAGISHI ,  Tohru NOMURA ,  Norihisa IMAIZUMI ,  Yasutomi ASAI

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L21/4807 ,  H01L23/13 ,  H01L23/15 ,  H01L23/315 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49506 ,  H01L23/49531 ,  H01L23/49822 ,  H01L23/50 ,  H01L23/562 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15192 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19015 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An electronic device includes: a substrate having first and second surfaces, wherein the first surface is opposite to the second surface; a first electronic element mounted on the first surface of the substrate; a second electronic element mounted on the second surface of the substrate; and a resin mold sealing the first electronic element and the first surface of the substrate. The resin mold further seals the second electronic element on the second surface of the substrate. The second surface of the substrate has a portion, which is exposed from the resin mold. The second electronic element is not disposed on the portion of the second surface.

Abstract translation: 电子设备包括：具有第一和第二表面的基底，其中第一表面与第二表面相对; 安装在所述基板的第一表面上的第一电子元件; 安装在所述基板的第二表面上的第二电子元件; 以及密封第一电子元件和基板的第一表面的树脂模具。 树脂模具进一步密封基板的第二表面上的第二电子元件。 基板的第二表面具有从树脂模露出的部分。 第二电子元件不设置在第二表面的部分上。