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公开(公告)号：US09528930B2
公开(公告)日：2016-12-27
申请号：US14759670
申请日：2014-01-16
Applicant: DENSO CORPORATION
Inventor： Junichi Ishikawa , Jun Tarui , Kiyoshi Otsuka , Makiko Sugiura , Takahiko Yoshida , Tomohide Ariki
CPC classification number: G01N21/43 , B60S1/0833 , G01N2021/435 , G01N2201/062
Abstract: An adhering matter determination portion includes an irradiation portion, a light receiving portion and a determination portion. The irradiation portion radiates a light to a plurality of different areas of a transparent plate. The light receiving portion converts reflected waves reflected at the different areas into electrical signals. The determination portion compares at least one of detection signals outputted from the light receiving portion with a determination threshold. When the detection signal is lower than the determination threshold, the determination portion determines that there is an adhering matter on the transparent plate. The determination portion compares the detection signals. When a difference of the detection signals is higher than a condensation determination value, the determination portion determines that the adhering matter is raindrops. When the difference of the detection signals is lower than the condensation determination value, the determination portion determines that the adhering matter is dewdrops.
Abstract translation: 粘附物质确定部分包括照射部分，光接收部分和确定部分。 照射部分将光照射到透明板的多个不同区域。 光接收部分将在不同区域反射的反射波转换为电信号。 确定部分将从光接收部分输出的检测信号中的至少一个与确定阈值进行比较。 当检测信号低于确定阈值时，确定部分确定在透明板上存在粘附物质。 确定部分比较检测信号。 当检测信号的差异大于冷凝判定值时，确定部分确定附着物是雨滴。 当检测信号的差低于冷凝判定值时，确定部分确定附着物是露珠的。
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公开(公告)号：US20150276615A1
公开(公告)日：2015-10-01
申请号：US14437877
申请日：2013-11-28
Applicant: DENSO CORPORATION
Inventor： Makiko Sugiura , Kiyoshi Otsuka , Tomohide Ariki
CPC classification number: G01N21/88 , B60S1/0833 , B60S1/0844 , G01N13/00 , G01N21/17 , G01N21/552 , H01L31/12
Abstract: An optical sensor is attached to a transparent board and includes: a light emitting element that applies light to the transparent board; a plurality of light receiving elements that receive light from the light emitting element, reflected by the transparent board; and a detection unit that detects the amount of rainfall based on output signals of the light receiving elements. The light emitting element applies light to one irradiation region in the transparent board. The light receiving elements correspond to the one irradiation region and the detection unit detects the amount of rainfall based on output signals of the light receiving elements corresponding to the one irradiation region.
Abstract translation: 光学传感器安装在透明板上，包括：向透明板施加光的发光元件; 多个光接收元件，其接收由所述透明板反射的来自所述发光元件的光; 以及检测单元，其基于所述光接收元件的输出信号来检测降雨量。 发光元件对透明板中的一个照射区域施加光。 光接收元件对应于一个照射区域，并且检测单元基于与一个照射区域对应的光接收元件的输出信号来检测降雨量。
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公开(公告)号：US09831146B1
公开(公告)日：2017-11-28
申请号：US15319475
申请日：2015-06-26
Applicant: DENSO CORPORATION
Inventor： Tomohide Ariki
IPC: H01L23/495 , H01L23/29 , H01L23/31 , H01L23/48 , H01L23/50
CPC classification number: H01L23/29 , H01L23/31 , H01L23/3107 , H01L23/3737 , H01L23/42 , H01L23/48 , H01L23/49503 , H01L23/49555 , H01L23/49568 , H01L23/49582 , H01L23/49586 , H01L23/50 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83385 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00014 , H01L2924/00
Abstract: A molded package includes an IC chip mounted on a first surface of a lead frame, and a molded resin encapsulating the lead frame together with the IC chip. The molded resin has a second surface-side opening portion that is formed to expose a chip correspondence portion of a second surface of the lead frame corresponding to the IC chip. A filler material is filled in the second surface-side opening portion. The filler material has a thermal conductivity equal to or greater than that of the molded resin and is softer than the molded resin. The chip correspondence portion has a rough surface with fine splits so as to increase a contact area with the filler material, and the filler material is in contact with the external member.
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