Inertial sensor and method for manufacturing the same

    公开(公告)号:US11733044B2

    公开(公告)日:2023-08-22

    申请号:US17730284

    申请日:2022-04-27

    CPC classification number: G01C19/5712

    Abstract: An inertial sensor includes a lower substrate and an upper substrate. The upper substrate includes a micro oscillator, electrodes and a pad, which are independent of each other. The micro oscillator includes a curved surface portion, a joint portion recessed inward from an apex of the curved surface portion and joined to a support portion of the lower substrate, a rim at an end of the curved surface portion and a conductive film covering the micro oscillator. The curved surface portion is in an aerial state. The rim is made of the same material as the electrodes, located on a virtual flat plane formed by the electrodes, and apart from and surrounded by the electrodes. A portion of the conductive film that covers the joint portion is electrically bonded to a lower metal film covering the support portion.

    Mounting structure of micro vibrator

    公开(公告)号:US12287203B2

    公开(公告)日:2025-04-29

    申请号:US18169438

    申请日:2023-02-15

    Abstract: In a mounting structure, a micro vibrator has: a curved surface portion having a hemispherical curved surface; a connecting portion extending from the curved surface portion toward a center of a hemispherical shape of the curved surface portion; and a surface electrode covering at least a part of the connecting portion and at least a part of the curved surface portion. A mounting substrate has two or more wirings and a part of the micro vibrator is connected to the mounting substrate. The wirings each have an electrode connection portion connected to a portion of the surface electrode covering the connecting portion at an end. The two or more wirings include a voltage application wiring and a voltage detection wiring. The voltage application wiring is spaced away from the voltage detection wiring on the mounting substrate.

    Adhering matter determination device
    4.
    发明授权
    Adhering matter determination device 有权
    粘附物质测定装置

    公开(公告)号:US09528930B2

    公开(公告)日:2016-12-27

    申请号:US14759670

    申请日:2014-01-16

    CPC classification number: G01N21/43 B60S1/0833 G01N2021/435 G01N2201/062

    Abstract: An adhering matter determination portion includes an irradiation portion, a light receiving portion and a determination portion. The irradiation portion radiates a light to a plurality of different areas of a transparent plate. The light receiving portion converts reflected waves reflected at the different areas into electrical signals. The determination portion compares at least one of detection signals outputted from the light receiving portion with a determination threshold. When the detection signal is lower than the determination threshold, the determination portion determines that there is an adhering matter on the transparent plate. The determination portion compares the detection signals. When a difference of the detection signals is higher than a condensation determination value, the determination portion determines that the adhering matter is raindrops. When the difference of the detection signals is lower than the condensation determination value, the determination portion determines that the adhering matter is dewdrops.

    Abstract translation: 粘附物质确定部分包括照射部分,光接收部分和确定部分。 照射部分将光照射到透明板的多个不同区域。 光接收部分将在不同区域反射的反射波转换为电信号。 确定部分将从光接收部分输出的检测信号中的至少一个与确定阈值进行比较。 当检测信号低于确定阈值时,确定部分确定在透明板上存在粘附物质。 确定部分比较检测信号。 当检测信号的差异大于冷凝判定值时,确定部分确定附着物是雨滴。 当检测信号的差低于冷凝判定值时,确定部分确定附着物是露珠的。

    Inertial sensor
    6.
    发明授权

    公开(公告)号:US11740087B2

    公开(公告)日:2023-08-29

    申请号:US17703164

    申请日:2022-03-24

    CPC classification number: G01C19/56 G01S19/47

    Abstract: A micro vibration body includes a curved surface portion, a recessed portion recessed from the curved surface portion, a bottom surface protruding portion protruding from a bottom surface of the recessed portion, and a through hole in the bottom surface protruding portion. A mounting substrate has a positioning recess, into which the bottom surface protruding portion is inserted, and electrode portions surrounding the inner frame portion. A joining member is in the positioning recess and joins the bottom surface protruding portion with the mounting substrate. The bottom surface is in contact with a region of the mounting substrate around the positioning recess. The bottom surface protruding portion has a tip end surface that is at a distance from the positioning recess. The joining member at least partially enters the through hole and is electrically connected to the conductive layer.

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