公开(公告)号：US20200258805A1

公开(公告)日：2020-08-13

申请号：US15780728

申请日：2016-12-01

Applicant: DENSO CORPORATION

Inventor： Tomohiro YOKOCHI ,  Kenichiro HASEGAWA ,  Hidetada KAJINO ,  Yasunori KASAMA

IPC: H01L23/367 ,  H01L23/13 ,  H01L23/14 ,  H01L23/40 ,  H01L25/065 ,  H01L25/07 ,  H05K1/02 ,  H05K3/46

Abstract: An electronic component module includes a substrate; a plurality of electronic components mounted on the substrate; and a heatsink fixed to the substrate.The substrate includes first, second and third substrates. The electronic components include first components and second components, and the first substrate and the second substrate are arranged such that the surface of the first and second substrates mutually face each other.The third substrate is disposed between the first substrate and the second substrate, whereby the first, second and third substrates are continuous. The heatsink includes a fixed portion fixed to at least one substrate among the first substrate, the second substrate and the third substrate, and a side portion located in a side area of a region sandwiched between the first substrate and the second substrate. The side portion is continuous with the fixed portion via a bend portion having a bent shape.

公开(公告)号：US20180242464A1

公开(公告)日：2018-08-23

申请号：US15756745

申请日：2016-08-08

Applicant: DENSO CORPORATION

Inventor： Kenichiro HASEGAWA ,  Tomohiro YOKOCHI ,  Yasunori KASAMA

IPC: H05K3/46 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K3/462 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16227 ,  H01L2224/48227 ,  H05K1/0271 ,  H05K1/113 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0014 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4623 ,  H05K3/4638 ,  H05K2201/09454 ,  H05K2201/09527 ,  H05K2201/09627 ,  H05K2201/09709 ,  H05K2201/09827

Abstract: Before a laminated body is subjected to hot pressing, at least two or more land electrodes are displaced from each other as viewed in the lamination direction, whereby at least two or more gaps disposed in the lamination direction are displaced from each other as viewed in the lamination direction. The hot pressing on the laminated body causes resin materials that compose resin films to flow and fill the gaps in the laminated body. Consequently, the planarity of a multilayer substrate can be improved to a greater extent than in a case where a plurality of gaps disposed in the lamination direction is located at the same position as viewed in the lamination direction.