公开(公告)号：US20160133539A1

公开(公告)日：2016-05-12

申请号：US14893987

申请日：2014-05-29

Applicant: DENSO CORPORATION

Inventor： Kengo OKA ,  Yuki SANADA ,  Masayuki TAKENAKA ,  Shinya UCHIBORI ,  Tasuke FUKUDA

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/56

CPC classification number: H01L23/3121 ,  H01L21/565 ,  H01L23/3135 ,  H01L23/49838 ,  H01L2224/48091 ,  H01L2224/49175 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A mold package includes a substrate having a first surface and a second surface disposed opposite to the first surface, a wiring part disposed on the first surface in protruded manner, a molding resin, and a resin film. The molding resin partially seals the first surface of the substrate and the wiring part and intersects with the wiring part. The resin film is disposed between the first surface of the substrate and the end of the molding resin, and seals the wiring part and the first surface of the substrate adjacent to the wiring part. The resin film includes a first portion disposed inside the molding resin and a second portion disposed outside the molding resin. An upper surface of the second portion is lower than an upper surface of the first portion and has less uneven portions than the upper surface of the first portion.

Abstract translation: 模具包装体包括具有第一表面和与第一表面相对设置的第二表面的基板，以突出方式布置在第一表面上的布线部分，模塑树脂和树脂膜。 模制树脂部分地密封基板的第一表面和布线部分，并与布线部分相交。 树脂膜设置在基板的第一表面和模制树脂的端部之间，并且密封布线部分和邻近布线部分的基板的第一表面。 树脂膜包括设置在模制树脂内部的第一部分和设置在模制树脂外部的第二部分。 第二部分的上表面比第一部分的上表面低，并且具有比第一部分的上表面少的凹凸部分。

公开(公告)号：US20190244886A1

公开(公告)日：2019-08-08

申请号：US16385285

申请日：2019-04-16

Applicant: DENSO CORPORATION

Inventor： Kosuke SUZUKI ,  Atsushi KASHIWAZAKI ,  Yuki SANADA ,  Toshihiro NAKAMURA ,  Shinya UCHIBORI

IPC: H01L23/498 ,  H05K1/11

CPC classification number: H01L23/49838 ,  H01L23/28 ,  H01L23/31 ,  H01L23/49827 ,  H05K1/114 ,  H05K3/28 ,  H05K2201/09236 ,  H05K2201/0989 ,  H05K2201/099

Abstract: A solder resist is configured such that pattern covering portions of the solder resist covering straight portions of adjacent wiring patterns are separated from each other in an area outside of a resin mold part. Thus, even if the solder resist is cracked, cracks will not be formed so as to connect between the adjacent wiring patterns. As such, even if moisture generated by condensation or the like enters in the crack, it is less likely that a short circuit will occur between the adjacent wiring patterns.

公开(公告)号：US20160183405A1

公开(公告)日：2016-06-23

申请号：US14392135

申请日：2014-06-17

Applicant: DENSO CORPORATION

Inventor： Yuki SANADA ,  Atsushi KASHIWAZAKI

IPC: H05K7/20 ,  H05K1/18

CPC classification number: H05K7/20127 ,  B29C45/14655 ,  B29C45/34 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3121 ,  H01L23/32 ,  H01L23/42 ,  H01L23/433 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/13055 ,  H01L2924/19105 ,  H05K1/181 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An air vent is formed in a substrate of an electronic device such that air in a cavity of a metal mold can be released through the air vent when a resin is molded. Solder resist is disposed on a second surface of the substrate and has an opening portion at a position corresponding to the air vent. As such, the air can be also released from a clearance between a lower mold and the solder resist resulting from a rough surface of the solder resist. The resin can be held in a space provided between the second surface of the substrate and the lower mold. Therefore, the resin having passed through the air vent can be restricted from flowing out, and the air vent can be restricted from losing its function due to the substrate and the metal mold closely contacting with each other.

Abstract translation: 在电子设备的基板中形成通风口，使得当模制树脂时，金属模具的空腔中的空气可以通过排气口释放。 抗蚀剂设置在基板的第二表面上，并且在对应于排气口的位置处具有开口部分。 因此，也可以从阻焊剂的粗糙表面产生的下模和阻焊剂之间的间隙中释放空气。 树脂可以保持在设置在基板的第二表面和下模具之间的空间中。 因此，可以限制通过排气口的树脂流出，并且可以限制排气孔由于基板和金属模具彼此紧密接触而失去其功能。