公开(公告)号：US20190023578A1

公开(公告)日：2019-01-24

申请号：US16070303

申请日：2017-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Hirofumi TAKEKUMA ,  Shinichiro YAMADA ,  Kazuhiro KIMURA ,  Takuhiro ISHII ,  Katsuya TANBA

IPC: C01B32/336 ,  B01J21/18 ,  B01J35/02 ,  B01J35/00 ,  B01J35/10 ,  B01J37/08 ,  B01J20/20 ,  B01J20/28 ,  B01J20/30 ,  C02F1/28 ,  B01D53/02

Abstract: A porous carbon material wherein a particle diameter is 10 μm or more but 1 cm or less; wherein a bulk specific gravity is 0.20 g/cm3 or more; and wherein a mesopore volume is 0.10 cm3/g or more.

公开(公告)号：US20160150680A1

公开(公告)日：2016-05-26

申请号：US14898858

申请日：2014-06-27

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke ARAMAKI ,  Atsuya YOSHINARI ,  Takuhiro ISHII ,  Shinichi UCHIDA ,  Masahiko ITO

IPC: H05K7/20 ,  H01L23/433 ,  F28F21/02 ,  F28F13/18 ,  B32B38/00 ,  B29C65/00 ,  B32B25/08 ,  B32B27/28 ,  B32B37/10 ,  H01L21/48 ,  B29C69/00

CPC classification number: H05K7/20481 ,  B29C65/002 ,  B29C66/45 ,  B29C69/001 ,  B29K2683/00 ,  B29K2995/0013 ,  B29L2031/18 ,  B29L2031/3481 ,  B32B25/08 ,  B32B27/283 ,  B32B37/10 ,  B32B38/0004 ,  B32B2250/24 ,  B32B2307/302 ,  B32B2383/00 ,  B32B2457/00 ,  F28F13/18 ,  F28F21/02 ,  H01L21/4871 ,  H01L21/4878 ,  H01L23/3737 ,  H01L23/42 ,  H01L23/433 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/16152 ,  H05K7/2049 ,  H01L2924/00

Abstract: Provided is a method of manufacturing a heat conductive sheet with improved adhesion and heat conductivity. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and pressing the molded product sheet.

Abstract translation: 提供一种具有改进的粘附性和导热性的导热片的制造方法。 该方法包括将包含导热填料和粘合剂树脂的导热性树脂组合物成型为规定形状，使导热性树脂组合物固化，得到导热性树脂组合物的成型体，切断成型体 制成片材，得到成型品片材，并压制成型品片材。

公开(公告)号：US20160141223A1

公开(公告)日：2016-05-19

申请号：US14899221

申请日：2014-06-27

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke ARAMAKI ,  Atsuya YOSHINARI ,  Takuhiro ISHII ,  Shinichi UCHIDA ,  Masahiko ITO

IPC: H01L23/373 ,  F28F21/02 ,  H01L21/48

CPC classification number: H01L23/3737 ,  F28F21/02 ,  H01L21/4871 ,  H01L23/3675 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/0002 ,  H01L2924/16152 ,  H01L2924/00

Abstract: Provided is a method of manufacturing a heat conductive sheet that itself is imparted with stickiness and has reduced heat resistance due to improved adhesion to a heat generator and a heat dissipater and that may be fixed provisionally without the need for using an adhesive agent or the like. The method includes the steps of molding a heat conductive resin composition, which includes heat conductive fillers and a binder resin, into a predetermined shape and curing the heat conductive resin composition to obtain a molded product of the heat conductive resin composition, cutting the molded product into sheets to obtain a molded product sheet, and coating an entire surface of a sheet main body (7) with an uncured component (8) of the binder resin oozing from the sheet main body (7).

Abstract translation: 提供一种制造导热片的方法，其本身具有粘性并且由于对发热体和散热器的粘附性的改善而具有降低的耐热性，并且可以暂时固定而不需要使用粘合剂等 。 该方法包括将包含导热填料和粘合剂树脂的导热性树脂组合物成型为规定形状，使导热性树脂组合物固化，得到导热性树脂组合物的成型体，切断成型体 制成片状物，用片材主体（7）渗出的粘合剂树脂的未固化成分（8）涂布片主体（7）的整个表面。

公开(公告)号：US20210347642A1

公开(公告)日：2021-11-11

申请号：US17380665

申请日：2021-07-20

Applicant: Dexerials Corporation

Inventor： Hirofumi TAKEKUMA ,  Shinichiro YAMADA ,  Kazuhiro KIMURA ,  Takuhiro ISHII ,  Katsuya TANBA

IPC: C01B32/336 ,  B01J20/20 ,  B01J20/30 ,  B01J20/28 ,  B01D53/02 ,  B01J21/18 ,  B01J35/00 ,  B01J35/02 ,  B01J35/10 ,  B01J37/08 ,  C02F1/28

Abstract: A porous carbon material wherein a particle diameter is 10 μm or more but 1 cm or less; wherein a bulk specific gravity is 0.20 g/cm3 or more; and wherein a mesopore volume is 0.10 cm3/g or more.

公开(公告)号：US20160104657A1

公开(公告)日：2016-04-14

申请号：US14892724

申请日：2014-06-18

Applicant: DEXERIALS CORPORATION

Inventor： Keisuke ARAMAKI ,  Atsuya YOSHINARI ,  Takuhiro ISHII ,  Shin-ichi UCHIDA ,  Masahiko ITO ,  Syunsuke UCHIDA

IPC: H01L23/373

CPC classification number: H01L23/3737 ,  B29C47/0004 ,  B29C47/0019 ,  B29C47/0021 ,  B29C47/0066 ,  B29C47/8805 ,  B29C2035/0822 ,  B29K2995/0013 ,  C09K5/14 ,  H01L21/4871 ,  H01L23/373 ,  H01L23/3733 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thermally conductive sheet, which contains: a binder; carbon fibers; and an inorganic filler, wherein the thermally conductive sheet is to be sandwiched between a heat source and a heat dissipation member of a semiconductor device, wherein the carbon fibers have an average fiber length of 50 μm to 250 μm, wherein thermal resistance of the thermally conductive sheet is less than 0.17 K·cm2/W, as measured in accordance with ASTM-D5470 with a load of 7.5 kgf/cm2, and wherein the thermally conductive sheet has an average thickness of 500 μm or less.

Abstract translation: 导热片，其包含：粘合剂; 碳纤维; 和无机填料，其中导热片被夹在半导体器件的热源和散热构件之间，其中碳纤维的平均纤维长度为50μm至250μm，其中热的热阻 导电片的负荷为7.5kgf / cm 2时，根据ASTM-D5470测定，小于0.17K·cm 2 / W，导热片的平均厚度为500μm以下。