公开(公告)号：US20170292049A1

公开(公告)日：2017-10-12

申请号：US15509877

申请日：2015-08-13

Applicant: Dow Global Technologies LLC

Inventor： Gary L. JIALANELLA ,  Andreas LUTZ ,  Eric E. COLE ,  Glenn G. EAGLE ,  Rajesh H. TURAKHIA ,  Yanli FENG

IPC: C09J163/00 ,  C09J5/06 ,  C09J11/02 ,  C09J175/04 ,  C09J153/00

CPC classification number: C09J163/00 ,  C08L63/00 ,  C09J5/06 ,  C09J11/02 ,  C09J153/00 ,  C09J175/04 ,  C08L71/02 ,  C08L75/04

Abstract: Aspects of the present invention provide a one component epoxy adhesive composition having improved impact resistance at low temperatures, such as −40° C. or less. In a first aspect, the adhesive includes one or more epoxy resins; at least one polyurethane based toughener; at least one amphipathic block copolymer; and one or more epoxy curing agents. In a further, aspect epoxy adhesive compositions having improved wash off resistance are also provided.

公开(公告)号：US20170204301A1

公开(公告)日：2017-07-20

申请号：US15312800

申请日：2015-07-14

Applicant: DOW GLOBAL TECHNOLOGIES LLC

Inventor： Glenn G EAGLE ,  Michael R. GOLDEN ,  Andreas LUTZ

IPC: C09J11/08 ,  C09J163/00 ,  B29C65/00 ,  B05D3/02 ,  B29C65/48 ,  C09J5/00 ,  B05D1/18

CPC classification number: C09J11/08 ,  B05D1/18 ,  B05D3/0254 ,  B29C65/4815 ,  B29C66/43 ,  B29K2105/0097 ,  B29L2031/30 ,  C08G18/10 ,  C08G18/8067 ,  C08K7/00 ,  C08K2201/005 ,  C08L75/04 ,  C09J5/00 ,  C09J5/06 ,  C09J163/00 ,  C09J2201/61 ,  C09J2203/10 ,  C09J2463/00 ,  C09J2467/00

Abstract: An uncured adhesive contains 2 to 10 weight percent of particles of a semi-crystalline organic material, preferably a polyester having a number-average molecular weight of 2000 to 10,000, a hydroxyl number of 10 to 60, and a melting temperature of 50 to 125° C. The adhesive is applied by heating it just prior to application, to melt the particles. After application, the adhesive is cooled to below the melting temperature of the semi-crystalline organic material, and then cured. The process allows the adhesive to be stored and pumped at ambient temperatures, due to the moderate viscosity of the material. Upon melting and re-cooling the semi-crystalline organic material, the adhesive assumes a high yield stress that imparts very good wash-off resistance. In preferred embodiments, the adhesive composition includes an epoxy resin and an epoxy curing agent.