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公开(公告)号：US20230216065A1
公开(公告)日：2023-07-06
申请号：US18007535
申请日：2020-07-11
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Shintaro OGAWA , Kazumasa IKARI , Toshihiko UEYAMA
IPC: H01M4/90 , H01M8/1246
CPC classification number: H01M4/9033 , H01M4/9091 , H01M8/1246 , H01M2008/1293
Abstract: A perovskite-type composite oxide powder is a perovskite-type composite oxide powder represented by a general formula ABO3-δ (where δ represents an amount of deficiency of oxygen and 0≤δ
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公开(公告)号：US20220231287A1
公开(公告)日：2022-07-21
申请号：US17712786
申请日：2022-04-04
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Yoshiaki AIKI , Toshihiko UEYAMA , Koji TANOUE
IPC: H01M4/36 , C01G33/00 , C01G23/00 , H01M4/525 , H01M4/62 , H01M4/505 , C01G51/00 , H01M4/131 , H01M4/1391 , H01M4/485 , H01M10/0525
Abstract: A producing method of a solution that contains lithium, at least one of a niobium complex and a titanium complex, and ammonia, wherein an amount of the ammonia in the solution is 0.3 mass % or less. The solution is suitable for forming a coating layer capable of improving battery characteristics of an active material in a battery.
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公开(公告)号：US20190228889A1
公开(公告)日：2019-07-25
申请号：US16337195
申请日：2017-09-29
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Kazuhiro YAMAGA , Tetsuya KAWAHITO , Toshihiko UEYAMA , Kenji SAKANE
Abstract: An object of the present invention is to provide a magnetic powder having a narrow particle size distribution of epsilon-type iron oxide particles, and another object is to provide magnetic powder suitable for magnetic recording medium by improving particle size distribution, and provide epsilon-type iron oxide magnetic particles and related technologies in which a number average particle diameter of major diameters (D50) is 10 to 20 nm, a 90% cumulative particle diameter (D90) is 30 nm or less, and a geometric standard deviation (σg) of major diameters is 1.45 or less, which are obtained by TEM observation.
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公开(公告)号：US20230197972A1
公开(公告)日：2023-06-22
申请号：US17925724
申请日：2020-08-07
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Kazumasa IKARI , Shintaro OGAWA , Toshihiko UEYAMA
IPC: H01M4/90 , H01M8/1246
CPC classification number: H01M4/9016 , H01M8/1246 , H01M2008/1293
Abstract: A composite oxide powder including a composition formula (1), wherein the ratio α/β of a surface area value α(m2/g) calculated by a BET one-point method to a surface area value β(m2/g) calculated from a formula (2) is greater than 1.0 and equal to or less than 1.5 and the surface area value α is equal to or less than 20 m2/g. ABO3-δ (1) (wherein A is one or more types of elements (La, Sr, Sm, Ca and Ba), B is one or more types of elements (Fe, Co, Ni and Mn) and 0≤δ
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5.发明申请公开(公告)号：US20210012936A1
公开(公告)日：2021-01-14
申请号：US16969839
申请日：2019-02-14
Inventor： Shin-ichi OHKOSHI , Asuka NAMAI , Marie YOSHIKIYO , Masahiro GOTOH , Toshihiko UEYAMA , Takayuki YOSHIDA
Abstract: There is provided a magnetic material that has an excellent electromagnetic wave absorption performance in a wide frequency range even under low temperature and high temperature environments and that ensures the absorption performance, and provided a magnetic material as a mixture of a magnetic material having positive slope of change in coercive force dependent on temperature, and a magnetic material having negative slope of change in coercive force dependent on temperature.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20190271694A1
公开(公告)日：2019-09-05
申请号：US16329579
申请日：2017-08-31
Applicant: TOHOKU UNIVERSITY , DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Daisuke NAGAO , Mikio KONNO , Haruyuki ISHII , Kumiko HAYASHI , Natsuki KOHAMA , Takayuki YOSHIDA , Toshihiko UEYAMA
IPC: G01N33/543 , G01N33/531
Abstract: To provide magnetic composite particles which can be separated from a sample solution in a short period of time using magnetism, and furthermore, have an excellent dispersion stability in the sample solution, which are magnetic composite particles in which an outer shell is formed on surfaces of core particles containing an inorganic oxide or a polymer, wherein the outer shell comprises magnetic nanoparticles and a silicon compound, the value of the volume average particle diameter (dTEM) of the magnetic composite particles measured by a transmission electron microscope is 30 nm or more to 210 nm or less, and the value of (dDLS)/(dTEM) which is the ratio of the value of the particle diameter (dDLS) of the particles measured by a dynamic light scattering method and the value of the volume average particle diameter (dTEM) is 2.0 or less.
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公开(公告)号：US20230311249A1
公开(公告)日：2023-10-05
申请号：US18024840
申请日：2020-09-30
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Keiichi ENDOH , Toshihiko UEYAMA
CPC classification number: B23K35/3006 , B23K35/025 , B23K2103/56
Abstract: There is provided a bonding paste capable of forming a uniform bonding layer by reducing occurrence of voids at edges even when a bonding area is large, and bonding method using the paste, and provides a metal paste for bonding containing at least metal nanoparticles (A) having a number average primary particle size of 10 to 100 nm, wherein a cumulative weight loss value (L100) when a temperature is raised from 40° C. to 100° C. is 75 or less, and a cumulative weight loss value (L150) when a temperature is raised from 40° C. to 150° C. is 90 or more, and a cumulative weight loss value (L200) when a temperature is raised from 40° C. to 200° C. is 98 or more, based on 100 cumulative weight loss value (L700) when the paste is heated from 40° C. to 700° C. at a heating rate of 3° C./min in a nitrogen atmosphere.
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公开(公告)号：US20180033530A1
公开(公告)日：2018-02-01
申请号：US15552415
申请日：2016-02-24
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Toshihiko UEYAMA , Masahiro GOTOH , Takayuki YOSHIDA , Takuyuki BABA
CPC classification number: H01F1/26 , C08K3/08 , C08K9/04 , C08L25/06 , C08L71/12 , C08L71/126 , C08L25/08
Abstract: An object of the present invention is to provide a magnetic compound excellent in high-frequency property and excellent in mechanical strength and related materials thereof by using at least one of resins selected from syndiotactic polystyrene (SPS) resin and modified polyphenylene ether (m-PPE) resin, including at least one of resins selected from syndiotactic polystyrene (SPS) resin and modified polyphenylene ether (m-PPE) resin, wherein content of the resin is 21 mass % or more.
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9.发明申请公开(公告)号：US20190229333A1
公开(公告)日：2019-07-25
申请号：US16313733
申请日：2017-06-28
Applicant: DOWA ELECTRONICS MATERIALS CO., LTD.
Inventor： Yoshiaki AIKI , Toshihiko UEYAMA , Koji TANOUE
IPC: H01M4/485 , C01G33/00 , C01G23/00 , H01M10/0525
Abstract: There is provided a solution containing lithium and at least one of a niobium complex and a titanium complex, excellent in storage stability, and suitable for forming a coating layer capable of improving battery characteristics of an active material, and a related technique, which is the solution containing lithium, at least one of a niobium complex and a titanium complex, and ammonia, wherein an amount of the ammonia in the solution is 0.2 mass % or less.
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公开(公告)号：US20160172328A1
公开(公告)日：2016-06-16
申请号：US14966585
申请日：2015-12-11
Applicant: DOWA Electronics Materials Co., Ltd.
Inventor： Keiichi ENDOH , Yutaka HISAEDA , Akihiro MIYAZAWA , Aiko NAGAHARA , Toshihiko UEYAMA
CPC classification number: H01L24/83 , B22F1/0014 , B22F1/0018 , B22F1/0062 , B22F7/064 , B22F9/24 , B22F2301/255 , B22F2303/01 , B22F2304/054 , B22F2304/056 , B22F2999/00 , B23K1/0008 , B23K1/0016 , B23K1/20 , B23K1/203 , B23K35/025 , B23K35/3006 , B23K35/36 , B23K35/3618 , B23K2101/42 , B82Y30/00 , C09J11/06 , C22C5/06 , H01B1/02 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/32 , H01L2224/29139 , H01L2224/29339 , H01L2224/2949 , H01L2224/32145 , H01L2224/32221 , H01L2224/83011 , H01L2224/83048 , H01L2224/83075 , H01L2224/83801 , H01L2224/8384 , H01L2924/00 , H01L2924/0002 , H01L2924/01005 , H01L2924/01006 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/014 , H01L2924/0665 , H01L2924/12042 , H01L2924/1301 , H01L2924/13033 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15747 , H01L2924/20106 , H01L2924/20107 , H01L2924/20108 , H01L2924/20109 , H01L2924/2011 , H01L2924/20111 , H01L2924/203 , H05K3/32 , H05K3/3489 , H05K2201/0257 , H05K2203/086 , H05K2203/1131 , H01L2224/2919 , H01L2924/3512
Abstract: A method of bonding two different substances includes the steps of: applying a bonding material containing a flux component that includes an organic material having at least two carboxyl groups to a bonding surface of a bonding object, disposing an object to be bonded on the bonding material, performing preliminary firing at a preset temperature in a state in which the object to be bonded is disposed, and performing a main firing by heating at a temperature higher than the temperature of the preliminary firing.
Abstract translation: 接合两种不同物质的方法包括以下步骤：将包含含有至少两个羧基的有机材料的助熔剂成分的接合材料施加到接合物的接合表面，将待接合物体设置在接合材料上 在设置待接合物体的状态下，在预设温度下进行预烧，并且在比预热的温度高的温度下进行加热。
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