公开(公告)号：US20130070102A1

公开(公告)日：2013-03-21

申请号：US13622304

申请日：2012-09-18

Applicant: DRS RSTA, INC.

Inventor： Eric J. Gustafson ,  Glen Francisco ,  Adam J. Ward

IPC: H04N5/33

CPC classification number: H04N5/33 ,  G01J5/043 ,  G01J2005/063 ,  H04N5/2251

Abstract: A thermal imaging system includes a mounting structure characterized by a first thermal conductivity and a focal plane array mounted to the mounting structure. The thermal imaging system also includes an optical system coupled to the mounting structure and a heating element coupled to the mounting structure. The thermal imaging system further includes a thermal isolator coupled to the mounting structure and characterized by a second thermal conductivity lower than the first thermal conductivity.

Abstract translation: 热成像系统包括安装结构，其特征在于第一导热系数和安装在安装结构上的焦平面阵列。 热成像系统还包括耦合到安装结构的光学系统和耦合到安装结构的加热元件。 热成像系统还包括耦合到安装结构的热隔离器，其特征在于低于第一热导率的第二热导率。

公开(公告)号：US09386239B2

公开(公告)日：2016-07-05

申请号：US13622304

申请日：2012-09-18

Applicant: DRS RSTA, INC.

Inventor： Eric J. Gustafson ,  Glen Francisco ,  Adam J. Ward

IPC: H04N5/33 ,  G01J5/04 ,  H04N5/225 ,  G01J5/06

CPC classification number: H04N5/33 ,  G01J5/043 ,  G01J2005/063 ,  H04N5/2251

Abstract: A thermal imaging system includes a mounting structure characterized by a first thermal conductivity and a focal plane array mounted to the mounting structure. The thermal imaging system also includes an optical system coupled to the mounting structure and a heating element coupled to the mounting structure. The thermal imaging system further includes a thermal isolator coupled to the mounting structure and characterized by a second thermal conductivity lower than the first thermal conductivity.

Abstract translation: 热成像系统包括安装结构，其特征在于第一导热系数和安装在安装结构上的焦平面阵列。 热成像系统还包括耦合到安装结构的光学系统和耦合到安装结构的加热元件。 热成像系统还包括耦合到安装结构的热隔离器，其特征在于低于第一热导率的第二热导率。

公开(公告)号：US09176298B1

公开(公告)日：2015-11-03

申请号：US14050289

申请日：2013-10-09

Applicant: DRS RSTA, Inc.

Inventor： Eric J. Gustafson ,  Jeff R. Emmett ,  Rachel L. Cooper ,  Samuel E. Ivey ,  Rohan G. Rodney ,  Brian R. Pekarek ,  Patrick J. Cronkite ,  Mark E. Durham

IPC: G02B7/02 ,  H04N5/225

CPC classification number: G02B7/008 ,  G02B7/026 ,  G02B7/028 ,  H04N5/2254

Abstract: Embodiments of the invention are directed to a springless athermal lens assembly. In one embodiment, a spacer of a springless athermal lens assembly may compensate for defocus of the camera system due to thermal expansion of the lens assembly through micro wedge mechanisms coupling the spacer to an inner and outer barrel. The inner barrel comprises a lens cell assembly and a body having a micro wedge slot. The outer barrel comprises a body having a micro wedge slot. The spacer comprises an inner barrel micro wedge and an outer barrel micro wedge. The spacer is configured to be physically coupled to the inner barrel through engagement of the inner barrel micro wedge and the inner barrel micro wedge slot. Further, the spacer is configured to be physically coupled to the outer barrel through the engagement of the outer barrel micro wedge and the outer barrel micro wedge slot.

Abstract translation: 本发明的实施例涉及无弹簧无热透镜组件。 在一个实施例中，无弹簧无热透镜组件的间隔件可以由于透镜组件通过将间隔件联接到内筒和外筒的微楔形机构的热膨胀而补偿相机系统的散焦。 内筒包括透镜单元组件和具有微楔槽的主体。 外筒包括具有微楔槽的主体。 间隔件包括内筒微楔和外筒微楔。 间隔件构造成通过内筒微型楔和内筒微型楔槽的接合物理耦合到内筒。 此外，间隔件构造成通过外筒微型楔和外筒微型楔槽的接合物理联接到外筒。